Taconic PCB Guide

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What is Taconic PCB

Taconic PCB is a ceramic-filled PTFE(Polytetrafluoroethylene)-based PCB reinforced with woven glass. It is designed to be used in high-frequency applications. It is flexible and has a low dissipation rate. This material has been manufactured by Taconic, a leader in the manufacturing of advanced materials, their Dielectric division manufactures high-quality circuit board materials for use in various fields of Engineering.
 
This board was designed to meet the rising demands in the Engineering technology. Taconic PCB features different values of dielectric constants therefore it has found a place in more than one application. Taconic PCBs can be produced using standard milling plating and shearing methods.

Understanding Taconic PCB materials

Taconic is an American brand name that produces various PCB materials targeted toward different applications in PCB technology. They offer a range of laminates and prepregs for PCB multicamadas fabrication. Some of the most widely used materials include:
FR-4
Glass fabric laminate reinforced with epoxy. This is the most common option and has become a standard in modern PCBs. Variants for this material include High TG FR-4, Low loss, and high performance.
RF-43
Ceramic-filled PTFE-based material. This material has a dielectric constant (Dk) of 3.66。It is designed for use in digital, microwave, and millimeter-wave RF applications
RF-45
PTFE-based composite reinforced with glass microfiber. This material has a low dielectric constant of 3.5. It also possesses high dimensional stability due to a reduced thermal coefficient of expansion in the z-axis.
TacLam
This is Taconic standard material, an FR-4 epoxy and glass fabric laminate available in a range of dielectric constants.
TacPreg
The standard prepreg material used by Taconic for their Taclam PCB materials.
Thermo-Materials
These are thermoplastic laminates and prepreg materials offered by Taconic which can be reworked and recycled
TLY
low-loss thermoset laminate material
TSM-XT
Ceramic-filled PTFE-based material
These materials are designed to provide excellent thermal, mechanical, and electrical properties while being easily manufacturable. The unique features of Taconic PCBs make them fit for advanced PCB applications such as; high-speed digital circuits, Radio frequency and microwave, and flex or flex-rigid PCBs.

Why Taconic PCB is the perfect choice

Thermal performance

Taconic materials like RF-43 and TSM-XT offer low coefficients of thermal expansion, this allows them to be used in extreme temperature working conditions with temperatures ranging from high to freezing. 
 

Integridade do sinal

Taconic PCBs have controlled dielectric constants combined with low-loss tangents, allowing them to maintain signal integrity in high-speed and RF circuits.
 
 

Ease of fabrication

Taconic materials are designed to be manufactured using standard PCB manufacturing procedures like ordinary materials.


Dimensional stability

Taconic laminates are designed to have high dimensional and positional accuracy during fabrication steps like inner layer alignment and lamination. This makes the PCBs achieve precise dimensions during fabrication.

Fiabilidade

The electrical, mechanical, and thermal properties of Taconic laminates are designed to withstand tough working conditions that challenge ordinary materials while maintaining their unique properties. This makes them valuable assets in applications where reliability is crucial, like military electronics, medical devices, and avionics.
 

Cost-effectiveness

Taconic PCB materials are not the cheapest materials in the market however, for their special offering, they provide a high performance per dollar ratio.
 
 

Types of Laminates produced by Taconic

Tacónico RF 35
 Manufactured by Taconic, this laminate is filled with ceramic and reinforced with a fiberglass braid. It is mostly used in high-performance PCBs like antennas, and power amplifiers. This laminated has a combination of properties that make it an ideal choice for RF and microwave applications. These features include; low dissipation, low moisture absorption, and impressive dimensional stability.
 
Tacónico CER 10
This is another PCB laminate offered by Taconic. It is also ceramic-filled and reinforced with woven glass. Taconic CER 10 has an interlaminar board with conductive layers on one or both sides. It is common in high-volume low-cost applications because of its ease of manufacturing due to dimensional stability.
 
Taconic TLY-5
These boards are known for their dimensional stability and uniform dielectric constant. They have a dielectric constant of about 2.20. Materials such as copper, aluminum, and brass are used to cover these laminates. They are also common in high-volume low-cost applications and their dimensional stability is often tested through a flammability test.

Types of Lamination Methods of Taconic PCBs

Taconic PCBs offer several types of lamination in manufacturing. Lamination is a configuration of the PCB physical layer stack-up. Lamination describes where the PCB substrates, the conductive layers, and the core and prepreg layers are to be located in the stack-up.
 
Multilayer PCB
Multilayer PCBs have several layers. These layers can be etched boards or conductive trace layers. Bonding of the layers is achieved through lamination under pressure and high temperature. This results in a board with multiple conductive layers sandwiched between prepreg or laminates.
 
 A double-sided PCB has a conductive layer on both sides of the PCB, with the PCB substrate in the middle separating them. For lamination of the PCB panel, a layer of photosensitive dry resist is used.
 
PTFE microwave laminates
These are some of the most common laminates used in PCB fabrication. They are known for their uniform dielectric constant, and low loss gradient. They are suitable for use in RF PCBs.
 
Sequential Lamination
This type of lamination is used if the PCB has more than two subsets. This method involves the combination of multiple-layer subsets in various processes.

Manufacturing process of Taconic PCBs

Step one: Imaging
This is the process that involves transferring the image of the design of the PCB that the Designer made using CAD software. The procedure has several ways:Photolithography using liquid,Photolithography using dry film, photosensitive film, and Direct imaging.
 
Step two: Etching
This is the process of using reactive chemicals to corrode parts of the conductive material that are not needed on the conductive layer to create traces and regions that the designer of the PCB intended to be on the layer. The most common etchant solvents include Ferric chloride, Ammoniacal, or cupric chloride.
 
Step three: Lamination
This stage only applies to multilayer components. It involves the bonding of the various layers using prepreg material. This step occurs at high pressure and temperature.
 
Step four: Drilling
Holes in the PCB are drilled in this stage, they include holes for through-hole components or vias.
 
Step five: Plating
This is a chemical process of depositing conductive material on the walls of the drilled holes, the conductive material can be copper, aluminum, brass, or gold.
 
Step six: Acabamento da superfície
In this step, the remaining exposed conductive layer after etching is to be covered to avoid oxidation corrosion or improve solderability and attachment of SMD components.
 
Step seven: Outer layer processing
  • Máscara de solda
At this stage, the conductive layer is bare and exposed to environmental elements, with the risk of short circuits corrosion of the conductive material, or even electric shocks for the use of the printed circuit board. A máscara de solda is used to cover the areas that do not have pads or holes.
  • silkscreen
After the application of the solder mask, the outer layer is blank and some text and graphics need to be added, these include: Component designators and values, Courtyard, PCB name and revision, Designer or company logo, and Markings of PCB sections functions and polarity of components.
 
Step eight: Testing
The board will be inspected at the end of the production line using automatic visual inspection, flying probe, and manual inspection functional testing.

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