É do conhecimento geral que a produção de placas de circuito impresso (PCB) de alta qualidade é um processo de trabalho intensivo que exige uma inspecção extensiva, testes, montagem e soldadura. Como resultado, fornecemos montagem DIP completa como um dos nossos serviços. Isto destina-se a cortar custos, melhorar a precisão e produtividade, e tornar todo o processo de montagem e verificação de PCB do início ao fim mais fácil e rápido.
DIP is the abbreviation for dual in-line package, also known as DIL package, and THT is the abbreviation for through-hole technology. In the PCBA industry, Montagem DIP representa quase o mesmo significado que Montagem do THT e é uma espécie de pacote de dispositivos electrónicos que consiste de uma caixa rectangular e duas filas paralelas de pinos de ligação eléctrica. Este tipo de Montagem de PCB refers to the process of mass-producing solder connections in which a printed circuit board (PCB) with components already installed is immersed in a tin furnace. All of the pins are parallel, point down, and stick out past the bottom plane of the package, at least far enough to be through-hole mounted to a printed circuit board (PCB), which means they can go through holes on the PCB and be soldered on the other side. The term “DIP” refers to a device packed as a plug-in, and the number of pins on this kind of device often does not exceed 100. Soldering DIP-packed components after surface mount technology (SMT) is a process that is often referred to as “DIP welding” or “DIP post welding.”
Most small and medium-sized integrated circuits also use this type of packaging. Most of the time, there are only 100 pins. A DIP-packaged CPU chip has two rows of pins that need to be inserted into a DIP-structured chip socket. It can, of course, also be plugged straight into a circuit board with the same number and arrangement of soldering holes. When plugging and unplugging a chip from a DIP packaging technology, one should take care not to damage the pins.
Why choose FS Technology's Electronics DIP Assembly?
A tecnologia FS está ao serviço da indústria electrónica há muitos anos e possui um vasto conhecimento no processamento DIP. Como a melhor turnkey through hole PCB assembly service company in China, we have served many projects in the welding machine and energy industry as well as the power control industry. The common theme of these projects is that the proportion of DIP processing on PCBA is relatively large. If you have specific demands for your printed circuit boards (PCBs), our process engineers are available to discuss DIP assembly technology in-depth. We guarantee on-time deliveries and, most importantly, the best possible customer service. DIP plug-in is an important part of the Processo de montagem de PCB and the quality of the DIP plug-in determines the quality of the PCBA processing. Next, let us show you our capabilities:
Escala de montagem DIP
- Full facilities from through-hole PCB fabrication to THT assembly;
- Comprehensive circuit board component procurement including Componentes SMD, DIP components, integrated circuits, etc.
- Multiple testing guarantee services: manual testing, AOI testing, X-RAY testing, aging testing, flying probe testing, etc.
- 7 fully automatic through-hole assembly lines (including plug-ins, repairs, hand soldering wires and lead-free solder pots, etc.) that can mass produce 25,000 pieces of DIP ordinary products per month (minimum);
- Para além do controlo de qualidade, a FS Technology também presta atenção à formação do pessoal, e conta actualmente com mais de 300 profissionais de produção;
- Coexistência de manual through hole assembly e montagem automática DIP;
- Pacote Cerâmico Duplo em Linha (CERDIP ou CDIP)
- Pacote Plástico Duplo em Linha (PDIP)
- Embalagem plástica retráctil em linha dupla (SPDIP)
- Pacote duplo em linha Kinny (SDIP ou SPDIP)
THT Assembly Quality Assurance
- Controlar rigorosamente a taxa de passagem do DIP;
- Trabalhadores com formação rigorosa, para controlar a Produtividade e a qualidade;
- Normas rigorosas de amostragem IPQC e QA LOT para assegurar a fiabilidade de Processamento THT;
- Before the plug-in, checks are done on the surface cleanliness of electronic components to detect oil stains, paint and other problems;
- During the plug-in, it is ensured that the electronic components are closed on the PCB to avoid unevenness and to uncover soldering pads well;
- If there is a direct indication on the surface of electronic components, we make sure that it is plugged in the correct direction;
- Attention is paid to the power strength of the plug-in components and to the PCB to avoid any damage due to excessive strength;
- Electronic components are not beyond the edge of any PCB board/frame, and we pay attention to the height and spacing between electronic components.
Processo de Montagem de PCB DIP
Inspecção do artigo
Primeiro verificamos e anotamos a quantidade, número de artigo, tamanho, número de serigrafia do componente DIP, valor, etc., de todas as peças que nos envia.
Esboço dos componentes DIP
Alguns esboços de componentes precisam de ser feitos com antecedência devido à forma como são feitos ou devido aos requisitos para a soldadura DIP PCB e todo o plano PCB.
Inserção de componentes de furo passante
In this step, we place the material for the plug into the pins and then insert the pins into the PCB board. During plugging-in, it is essential to pay attention to the strength of the plug-in to prevent any damage to the circuit board or the nearby components. At the same time, we make sure that the Orientação de componentes PCBA posição e a altura dos componentes são todas consistentes entre si.
Soldadura por Onda
Nowadays, PCB assembly factories usually process the circuit boards after DIP through hole assembly by soldadura por ondas. In wave soldering, flux is applied to a printed circuit board (PCB) during an in-line procedure. The printed circuit board is then preheated before being submerged in molten solder.
The procedure of DIP wave soldering is done automatically. Having said all of that, the process starts with a PCB board which continues to travel ahead beside the conveyor belt.
After this, a machine sprays the board in a separate tank. At this point, a very thin coating of flux will be applied to the underlying surface of the PCB and its pins. After that, the board plate will go down to a zone where it is preheated.
In this region where the board is covered in flux, the solvent begins to evaporate. Then, the active agent and the resin present in the Fluxo PCB will undergo a process of decomposition and activation. During this step, you must give the board and the components complete preheating.
O fundo da prancha encontra a sua primeira onda de solda derretida enquanto a prancha continua a avançar. O fluxo de soldadura é impresso no PCB com a ajuda desta onda. A segunda onda de solda quente atinge então o fundo da placa de circuito impresso (PCB).
Esta onda moderada contribui para a divisão da ponte de ligação que se encontra entre a extremidade da soldadura e o pino. Para além disso, elimina falhas de soldadura.
There is a wide variety of solder machines on the market. Let’s briefly take a look at the machines!
Máquina de Soldar Ondas
A soldering machine typically has the following four components:
- Pulverizador de fluxo
- Almofada de pré-aquecimento
- A bomba cria a onda
- Solda panorâmica
A wave soldering machine has a solder tank that is first heated up and a specific temperature is kept on it for the soldering process.
Most of the time, a solder wave is inside the tank and the PCBs will go over the bottom of the board. This means that the board links up with the solder wave at that point.
Additionally, one needs to be careful when changing the wave’s height. By doing this, you would have to stop the wave from going over the front of the board. This is when the solder gets to where it needs to be.
The metal fingers on the conveyor make sure that the PCB stays in place in a specific spot. Different temperatures won’t hurt the metal fingers as it is made of titanium. Plus, the solder doesn’t change it in any way.
Soldadura Manual de Componentes
A soldadura manual é um método tradicional de soldadura de componentes com chumbo a um PCB. É geralmente utilizado para montagem de pequenos lotes de PCB, trabalho de montagem em laboratório, retrabalho/reparação, e a adição de componentes extra numa montagem soldada à máquina.
Espaçamento entre as partes
Os componentes soldados manualmente devem ser colocados mais longe de outros componentes para evitar a soldadura por ponte de solda. Tipicamente, deve ser mantido um espaçamento entre almofadas de 50 a 100 milímetros.
Na maioria dos casos, a solda é aplicada como fio fluxado. Ao produzir ligações soldadas manualmente, o operador pode ver a criação da junção e ajustar o processo de soldadura a diferentes circunstâncias, tais como a soldabilidade. Com isto em mente, a soldadura manual é ainda utilizada para fazer ligações eléctricas que necessitam do maior nível de fiabilidade. Contudo, quando é necessária a soldadura a granel, a soldadura manual de alta qualidade não é economicamente prática.
Utilização de ferro de solda
Aprender a soldar à mão é um talento adquirido. Uma corrente eléctrica é utilizada para aquecer a ponta do ferro de soldar. Uma peça de soldadura é uma peça metálica com uma ponta estanhada utilizada para soldar. Uma vez que a condução de calor da ponta para as juntas é geralmente fraca, a temperatura da ponta deve ser maior do que a temperatura de soldadura.
Um ferro de soldar com uma ponta devidamente estanhada é essencial para conseguir ligações de qualidade. Apenas um pano ou esponja húmida, nunca uma lima ou escova de aço, deve ser utilizada para limpeza. Os pedaços de ferro de soldar comercialmente disponíveis vêm numa vasta gama de formas e tamanhos, com alguns a serem explicitamente concebidos como pedaços de ferro de soldar por aspiração oca. Muitos têm defendido a normalização das pontas, embora isto ainda não tenha acontecido.
Lavagem de tábuas
The surface of the PCBA will still have flux, ionic impurities, organic residues, and other substances after the soldering process is complete. The majority of circuit leakage may be attributed to the impurities that have attached themselves to the surface of the PCBA board. These compounds have the potential to cause harm to electronic components and disrupt circuits. Ionic contaminants on the board’s surface can cause it to malfunction if it is kept in a humid environment. This will lead to common PCBA failures or even circuit board shorts. Because of this, not only is it necessary for us to limpar o PCB antes da soldadura, mas também a limpeza que ocorre após a soldadura é da maior importância.
Even though water washing is one of the more affordable options, it is often used only after an in-depth investigation of technical procedures has been conducted. Water-washing fluxes must be powerful enough to leave behind corrosive residues on the PCB and its components if they are to be used. It’s essential to keep in mind that water won’t remove rosin-based or synthetic, water-insoluble fluxes. Although water cleaning is a cost-effective option, it requires a thorough understanding of the underlying technology before it can be used effectively.
Cleaning the PCBA board can be used as one of the criteria to measure the strength of a through hole PCB assembly factory. As far as I know, many small workshops do not wash the board after the montagem através de furos is completed, which may eventually lead to a rather ordinary inspection of the product by a customer although problems may arise when it is put into electronic applications.
Inspecção e Teste de Funcionalidade
During the through hole assembly process, your printed circuit board (PCB) must undergo several checks and the Inspecção de montagem de PCB process includes: visual inspections, Inspecção AOI, in-circuit testing (ICT) or flying probe tests, and even automated or semi-automatic bench tests. Printed circuit board (PCB) functional testing determines if we will send a produced board to a customer after it has been made and left the factory. PCB functional testing is the most exhaustive testing regimen available. The objective is to uncover manufacturing faults that impair dependability, such as missing or wrong components, and solder connections that aren’t correctly connected.
This all means that the DIP PCBA board is subjected to incoming inspections that comply with the applicable standard and regulations. Things that need to be checked when inspecting components include whether the components’ performance, specifications, and packaging meet order requirements, product reliability requirements, assembly technology and equipment requirements, and storage requirements. In addition to the basic checks mentioned above, we also test the lead collinearity and lead coating layer thickness to verify that they can withstand heating and comply with the technology’s requirements.
Produto Completo
After ensuring that there are no issues, the printed circuit board assembly (PCBA) will be put together with the housing, put through further testing, and ultimately sent. The creation of PCBAs is a loop of a ring, and since any fault in one link would substantially influence the quality of the product as a whole, strict control of each step is essential.
As a PCB assembly company, FS Technology has spent a lot of time honing its expertise in DIP assembly. We are a one-stop shop for DIP assembly, electronic component procurement, finished product assembly, and testing.
Para além da implementação da gestão global da qualidade e do ambiente, utilizamos também maquinaria de vanguarda para fabrico de PCB e testes.
Manual or automatic through hole PCB assembly?
Montagem automatizada através de furos
Em THT automated assembly, machines that are controlled by a computer are used to position components on a circuit board. We may accomplish this by using various methods, such as machines to arrange components on the board or by using machines to solder the components into place. Using equipment, FS technology ensures the best quality product assembly at the lowest feasible cost. Scheduled preventative maintenance is used to keep all of FS technology’s machinery in good working order. Here are the advantages of choosing our automated DIP assembly services:
- Fully automatic equipment can easily achieve fast turnaround PCB assembly, and it is more suitable for montagem de alto volume de PCB. The assembly method is ideal for swiftly constructing a large number of PCBA or creating anything that is highly complicated and has a lot of DIP components;
- Automated assembly may help you save both time and money while producing products of a high standard. Compared to manual assembly, automated thru-hole assembly offers a variety of benefits that may make it the superior option;
- The primary advantage is that machines position components considerably more rapidly than a person can. In addition to this, the method is versatile enough to deal with boards of varying dimensions and degrees of complexity.
Montagem manual através de orifício
When it comes to complex DIP assembly tasks, FS technology is up to the task. We’ve structured our manual lines to cut down on product movement and worker motion as much as possible. The accurate and complete assembly is guaranteed by careful documentation and in-process inspections. We are a versatile and reasonably priced contract manufacturer because of our DIP assembly expertise. Manual printed circuit board DIP assembly is performed using a microscope, so it is slower and suitable for small batch PCB assembly orders. Here’s why through-hole assembly has survived:
- Low-volume orders, especially those involving very tiny or fragile components, sometimes need this assembly;
- There is a high degree of accuracy, and the user may readily adjust the positioning of each part. However, it is time-consuming, costly, and challenging to master;
- Assembling by hand provides greater room for personalization and adaptation. When using automated DIP assembly, you can only work with the components the machine offers;
- Assembling components by hand also encourages greater originality and improvisation. You may be creative in your approach to PCB assembly without being limited by mechanical means. This might result in increased product quality and a more significant advantage in the market;
- As falhas de energia e outros factores ambientais podem ter um impacto negativo na montagem automatizada, levando a produtos defeituosos. A montagem manual é imune a atrasos como este. Pode exercer maior influência sobre o resultado final.
Which is better: manual or fully automated THT assembly?
Ao decidir entre montagem manual e automatizada de PCB, há muitas considerações diferentes a considerar. O tamanho e complexidade da placa de circuito impresso (PCB), o número de montagens necessárias, e o grau de precisão requerido, são muitas vezes preocupações essenciais.
A montagem manual é preferível para PCBs menos complexos e mais pequenos, como indicado anteriormente. Por outro lado, leva mais tempo do que a montagem automatizada. A montagem automatizada é preferível para placas de circuito impresso que são maiores e mais complicadas. O preço é mais elevado, mas o tempo de montagem é reduzido em comparação com o trabalho humano.
What is the difference between SMT and DIP Assembly?
SMT employs a technique called “sticking” whereas DIP utilizes a technology called “plugged-in.” Electronic components that use the DIP standard feature two rows of pins. In most cases, surface mount technology is put on the top surface of components that do not have pins or short leads and SMT assembly follows these basic criteria:
- The solder paste must be printed on the circuit board;
- The board must be mounted using the mounter;
- The device must be repaired by soldadura por reflow.
Por outro lado, o dispositivo de embalagem em linha conhecido como "soldadura por imersão" pode ter as suas ligações reparadas utilizando a soldadura por ondas ou a soldadura manual.
Apenas componentes sem pinos ou pinos curtos, tais como QFN, DFN, e Montagem BGA componentes, podem ser montados utilizando a tecnologia de montagem de superfície conhecida como Montagem SMT. Deve primeiro imprimir pasta de solda na placa de circuito impresso (PCB), depois utilizar uma máquina de montagem de superfície (SMT) para soldar os componentes, e depois utilizar soldadura de refluxo para fixar os componentes na PCB.
Enquanto que o DIP é utilizado para soldar os componentes que vêm numa embalagem de furo passante, os componentes podem ser fixados num PCB utilizando a soldadura por ondas ou a soldadura manual.
SMT and DIP are both components of the labor that goes into PCB Assembly; however, not all PCBA businesses have strong SMT and DIP competence, and the quality of the soldering on the PCBs varies from company to company. Suppose you are considering working with a new PCBA manufacturer. In that case, you should see the manufacturer to check how things are together, the equipment used to make things, and other vital parts. A tecnologia FS fornece serviços SMT e DIP da mais alta qualidade.
Vantagens do DIP sobre o SMT
Os benefícios da montagem do DIP são evidentes. Segue-se uma lista de algumas das razões:
- Temperatura
Electrolytic capacitors, metal oxide film resistors, and transistors are PCBA components that may be damaged by exposure to temperatures that are too high. Due to their temperature resistance ranging from 105-235 °C, these components cannot be soldered using reflow soldering;
- Problemas de embalagem
SMT packaging still needs sockets, terminals, and high-power components. This is due to the fact that these components are challenging to manufacture and assemble. Due to this factor, we are restricted to using just the DIP packaging type for such components;
- Problema dos custos
In spite of the fact that many commonly used components, including integrated circuits, inductors, transformers, diodes, and transistors, currently come in SMT packaging, DIP containers are much less expensive than SMT packages;
- Consumo de energia e tamanho
Várias outras considerações, incluindo o consumo de energia e o tamanho, causam a necessidade de empregar componentes DIP em vez de componentes SMT em alguns desenhos.
Conclusão
The PCBA electronic processing industry continues to rely heavily on DIP for various reasons, making it a vital component. In contrast to the SMT plug-in, which is automated, the DIP plug-in calls for a large-scale manual process that takes a significant amount of human effort. Due to the extensive labor percentage, the failure rate of DIP assembly is considerable. As a result, keeping an eye on the quality of the PCBA when performing DIP processing is essential. DIP is the follow-up work of SMT, an important part of the PCB assembly process. However, large-sized components cannot be inserted by the auto machine, but manually plugged in, and then passed through the reflow oven to finally be soldered.
Portuguese 
English 
German 
Japanese 
French 
Italian 
Russian 
