Conjunto de cerâmica quadrada plana-CQFP

CQFP, which stands for Ceramic Quad Flat Pack, utilizes expensive ceramic material, as the name suggests. In the electronics manufacturing industry, components that use ceramic materials such as PCB cerâmico are costly. CQFP is fabricated using dry pressing, where two rectangular or square ceramic pieces (lid and base) are dry pressed, screen printed with solder glass, and then glazed. The glass is then heated to embed the leadframe into the softened glass of the base, creating a mechanical connection. Once the semiconductor device is mounted and the wires are bonded, a cover is placed on top of the assembly, heated to the melting point of glass, and allowed to cool.

Ceramic Quad Flat Pack

CQFPs have leads on all four sides, typically coated with gold or Kovar, which makes it easy to mount to a printed circuit board (PCB). Lead spacing can vary from 0.5mm to 1.27mm, and quantities are usually between 28 and 352, which is beneficial for applications that require a reliable and long-lasting IC package. Furthermore, compared to plastic packages, ceramic packages can withstand various high-temperature environments and can operate continuously in environments up to 1000 °C while providing exceptional electrical performance. Here is the table for CQFP packaging with some specifications:

Part NumberPin CountBody Size (inches)Body Size (mm)Lead Pitch (mm)
52CQFP-19.0 mm-1.27 mm52.750” square19.0 square mm1.27 mm
68CQFP-24.1 mm-1.27 mm68.950” square24.1 square mm1.27 mm
84CQFP-16.5 mm-.65 mm84.650” square16.5 square mm.65 mm
100CQFP-19.0 mm-.65 mm100.750” square19.0 square mm.65 mm
132CQFP-24.1 mm-.65 mm132.950” square24.1 square mm.65 mm
144CQFP-26.6 mm-.65 mm1441.050″ square26.6 square mm.65 mm
172CQFP-29.2mm-.65mm1721.150″ square29.2 square mm.65 mm
196CQFP-32.0mm-.50mm1961.260″ square32.0 square mm.50 mm

Although this packaging form has many advantages, Tecnologia FS recommends that you consider the profitability of your product when choosing because it is more expensive and is not suitable for consumer electronics.

Blogue sobre embalagens IC

QFN de cerâmica

QFN cerâmico Em cenários que exigem resistência a ambientes corrosivos ou exigências de alta frequência, a implementação da tecnologia QFN de base cerâmica pode surgir como uma escolha estratégica. Por

Ler mais "

BGA vs. QFN No campo da eletrónica, a seleção do formato de embalagem correto para circuitos integrados é uma das principais tarefas dos engenheiros. Esta

Ler mais "
Noções básicas sobre o encapsulamento QFN

Noções básicas sobre o pacote QFN O QFN, também conhecido como pacotes Quad Flat No-leads, é um tipo popular de embalagem de circuito integrado de montagem em superfície utilizado em vários produtos electrónicos

Ler mais "
Explorando o valor do pacote CerDIP

Explorando o valor do pacote CerDIP O CerDIP, abreviatura de ceramic dual in-line package e também conhecido como pacote CDIP, é um pacote microelectrónico amplamente reconhecido

Ler mais "