In the field of electronics, selecting the correct package form for integrated circuits is one of the key tasks for engineers. This includes the oldest form of DIP packaging, the compact and highly integrated CSP packaging, and the solder ball grid array-based LGA packaging, among others. Undoubtedly, these packages have unique characteristics and application domains. To facilitate a smoother progress in your electronic engineering endeavors, this article by Tecnologia FS offers an essential packaging guide to differentiate between two commonly used packages: QFN and BGA.

bga qfn
DefinitionQFN stands for Quad Flat No-Lead, which is a type of surface mount package.BGA stands for Ball Grid Array, which is connected to the PCB through an array of solder balls on its bottom side.
Lead Configuration
  • Pins are on all four edges of the package and there are no bottom pins;
  • Arranged in a grid, each edge has a certain number of pins;
  • Fine pitch;
  • The leads cover the entire bottom area, forming a grid-like arrangement and are invisible;
  • There are solder balls on the bottom for connecting the package and the circuit board;
  • Can cover more pins;
  • Greater spacing;
Package ShapeSquare or rectangularRound
ApplicationsCommonly used in electrónica de consumo PCB, common ones include smartphones, tablets, smartwatches, etc.The first choice for high-performance applications, including GPU, CPU, PLC, etc.
  • Suitable for large-scale production and lower cost;
  • There is a metal cooling pad at the bottom, which can effectively dissipate heat;
  • Use short pins to reduce signal transmission delay and improve circuit performance and speed;
  • Packages are usually compact and suitable for thin, light and miniaturized designs.
  • The solder ball connection is very strong and has good resistance to mechanical stress and vibration;
  • BGA uses more leads and the arrangement of solder balls helps to evenly distribute heat so that it has better heat dissipation than QFN;
  • In complex applications, BGA provides better electrical characteristics to help reduce signal loss and crosstalk;
  • Using lead-free soldering technology, using lead-free alloys instead of traditional lead-tin alloys to make the project comply with the Diretiva RoHS;
  • Pads on the bottom may cause soldering difficulties;
  • Difficult to repair when it breaks down;
  • In contrast, the limited number of leads, potential thermal;
  • The high difficulty of Montagem BGA may increase the project cost;
  • Potential solder ball defects, need to rely on Raio X or other advanced testing methods;
  • Designers need to consider factors such as solder ball arrangement and array size to increase design complexity;

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