PDIP Package: Best Lightweight IC Circuit Solution
Integrated circuit is integral to the functioning of modern electronic applications and are ubiquitous in circuit board designs. Featuring a multitude of transistors, resistors, and capacitors, the IC can be viewed as a condensed form of printed circuit board. Consequently, discussions surrounding IC chips often revolve around optimizing their installation onto circuit boards. Among the various IC package types available, the PDIP package stands out as the most widely employed, owing to its versatility and mature design. In this article, FS Technology will provide an in-depth exploration of PDIP, focusing on its significance in integrated circuit packaging.
What is PDIP
The PDIP full form is the Plastic Dual In-line Package, one of the prevalent packaging options within the DIP Package category. It leverages plastic materials, such as epoxy resin or phenolic resin, known for their commendable electrical insulation properties.
The assembly process for PDIP components closely aligns with other through-hole technologies. It entails perforating holes on the PCB and establishing connections between the electronic components and a plastic package featuring two parallel rows of pins. These pins extend from the package’s underside in a linear fashion, precisely aligning with the circuit board’s drilled holes to establish seamless interconnections. Noteworthy applications of PDIP packages encompass operational amplifiers, logic gates, and memory chips.
PDIP IC packages maintain a consistent form factor with dual body sizes of 300 mil and 600 mil. With a lead spacing of 2.54mm, capable of accommodating single leads, the pin count options range from 8 to 64, enabling customization in line with project-specific requirements.
Why PDIP Packaging is Important in Electronics
Features of PDIP Package
- Refined: As a cost-effective choice among DIP packaging methods, utilizes plastic materials. However, its costs often surpass those of SMD packaging.
- Manual assembly: Manual insertion of PDIP components remains a challenging task, making automation difficult to achieve. Consequently, PCBA companies often rely on manual plug-in processes, leading to time-consuming and labor-intensive procedures that may result in higher failure rates for large-scale projects. Nevertheless, FS Technology offers a solution to these challenges. For PCBA prototype projects, we swiftly complete the assembly through manual procedures. In the case of batch projects, we employ state-of-the-art DIP plug-in machines for automated insertion.
- Limited gas tightness: PDIP packaging may not be suitable for humid environments, as exposure to moisture can lead to package failure. The seal between the plastic components and the package’s structure may introduce uncertainty.
- High-tech capability: This packaging harnesses the excellent thermal conductivity of copper (CU), a material known for its superior heat dissipation properties. This high thermal energy transfer, facilitated by the copper framework, positions PDIP as an optimal choice for applications requiring efficient heat management in integrated circuits.
Plastic Dual In-line Package In Circuit
- Microcontroller: This is an integrated circuit that combines a central processor, memory, input/output interfaces, and various peripheral functions. It serves as the central processing unit of modern electronic devices. Many microcontrollers, including popular series such as 8051, PIC, and PIC, are commonly packaged in PDIP.
- Memory module: These are modular components that integrate multiple memory chips and are used for storing data and instructions. For reliable data storage and retrieval, memory modules such as EEPROM and EPROM often utilize PDIP packaging.
- Digital integrated circuits: In industrial automation systems, digital integrated circuits perform various digital logic functions using logic gates, triggers, counters, multiplexers, and memory components. PDIP is a commonly used packaging type for digital integrated circuits.
Properties of Plastic Dual In-line Package
| Lead Count | Width | Length | Thickness | Pitch | Max. Height |
|---|---|---|---|---|---|
| 8 | 6.52mm | 9.53mm | 3.24mm | 2.54mm | 4.19mm |
| 10 | 6.61mm | 22.86mm | 3.94mm | 2.54mm | 4.95mm |
| 12/16 | 6.61mm | 29.91mm | 3.94mm | 2.54mm | 5.33mm |
| 22 | 13.53mm | 37.4mm | 7.75mm | 2.54mm | 8.89mm |
| 24 | 13.71mm | 31.75mm | 4.57mm | 2.54mm | 5.08mm |
| 28 | 13.525mm | 37.4mm | 4.07mm | 2.54mm | 6.35mm |
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