PCB Assembly Functional Test

Our testing provides extensive testing capabilities to meet customer requirements. The pcb assembly testing team ensures that our customers receive defect-free products of the highest quality and long-term reliability.

Directory of Functional Tests

PCB Assembly Inspection Checklist

We utilize advanced pcba testing equipment to reduce incidents of failure and then drive process improvement. These include:

PCB Assembly Visual Inspection

Manual testing relies directly on visual inspection to confirm the placement of components on the PCBA. This is the most traditional method and has been widely used. But there are many components in a PCBA, and most of them are small, making this approach flawed. Some functional defects are hard to detect and data is not easy to collect. As a result, visual inspection of pcb assembly is often just one of many testing steps in the production process.

X-Ray Detection

Automated X-ray inspection is primarily used to detect defects in ultra-fine pitch and ultra-high-density circuit boards, as well as circuit bridges, missing chips, misalignment, and other defects created during assembly. The inspection principle is to use the difference in X-ray absorption of different substances to inspect the part to be tested and find defects. Internal defects in IC chips can also be detected using tomography and is the only way to test the quality of ball grid array and solder ball bonding.

AOI for PCB Assembly Test(Automatic Optical Inspection)

Automated optical inspection, known as automated visual inspection, is a relatively new method of identifying manufacturing defects. It is based on optical principles and comprehensively uses image analysis, computer and automatic control technology to detect and deal with defects encountered in production. AOI is often used before and after reflow and before electrical testing to improve the yield of electrical handling or functional testing. At this time, the cost of correcting defects is much lower than the cost after final testing, generally more than ten times.

ICT PCBA Testing( In-Circuit Test )

There are several test methods, such as bed of needles tester and flying probe tester. Identify manufacturing defects with electrical performance testing and test analog-digital and mixed-signal components to ensure they meet specifications. The main advantages are low test cost per board, powerful digital and functional test capabilities, fast and thorough short and open circuit testing, programmable firmware, high defect coverage, and ease of programming. The main disadvantages are the need for test fixtures, programming and debugging time, expensive fixture manufacturing, and difficulty in use.

PCBA Functional Test (requires test modules)

Functional test is the earliest automatic test principle, which is a comprehensive test of circuit board functional modules using special test equipment in the middle and end of the production line to confirm the quality of the circuit board. Functional system testing is based on a specific board or a specific unit and can be done using a variety of equipment. There are final product tests, latest physical models and stack tests. PCBA functional testing generally does not provide in-depth data to improve the process, but requires special equipment and specially designed test procedures.

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