List of PCB & PCBA Manufacturers in China
Overview: This article collects information on China’s more well-known PCB companies. If you are looking for a Turnkey PCB Assembly company in China, it may have a good reference value for your PCB processing.
Here is our list of pcb manufacturing companies
- Huaqiang PCB
Shenzhen pcb prototype manufacturer – Huaqiang PCB
Shenzhen Huaqiang Jufeng Electronic Technology Co., Ltd. (Huaqiang PCB) was established in Shenzhen in 2011. The company specializes in the manufacture of 2-16 layers of printed circuit boards, and it is China’s leading prototype pcb assembly manufacturer and small batch circuit board supplier. The company has always been the service concept of producing the best quality products at the fastest speed. In 2020, Huaqiang PCB invested tens of millions to introduce advanced equipment and strictly control production standards to ensure that the products shipped are of Seiko quality. After two years of development, Huaqiang PCB company has grown rapidly in scale, and its prototype and small batch shipment capacity has reached 1,000 models/day. The company’s products are applicable to a wide range of fields, including communications, medical equipment, industrial control products, aviation, military products, test instruments, automobiles, computer peripheral products, consumer electronics, and colleges and universities and other technological fields. FS Technology believes that it can be used as the face of Shenzhen PCB manufacturing industry, so it is placed first in the list of printed circuit board manufacturers. The following are its project capabilities:
| Project | Process Capability | Remark | |
| Layers | 1-20 layers | ||
| HDI Structure | Level 1-3 | Mechanical blind burial or laser blind burial (can be electroplated and filled) | |
| Surface Treatment | With/Without lead spray tin, immersion gold, OSP | ||
| Plate Thickness Range | 0.6-2.5mm | Conventional Thickness: 0.6/0.8/1.0/1.2/1.6/2.0 /2.5mm | |
| The thickest plate thickness in large batches can be processed to 3.0mm | |||
| Plate Thickness Tolerance | T≥1.0mm ±10% | ||
| T<1.0mm ±0.1mm | |||
| Laser Hole Range | Used for blind hole plate, the tolerance of laser hole is ±0.01mm | ||
| Mechanical Drilling Range | 0.15-6.35mm | The minimum drill hole is 0.15mm, and the maximum drill bit is 6.35mm; holes larger than 6.35mm need to be processed separately | |
| Minimum Metal Slot | 0.45mm | Slot Hole Diameter Tolerance is ±0.1mm | |
| Minimum Non-Metallic Slot | 0.8mm | The minimum gong knife is 0.8mm | |
| Drilling Aspect Ratio | 10:01 | The thickest hole of 0.2mm can drill the thickness of 2.0mm | |
| Hole tolerance | ≤0.075mm | ||
| Bore Tolerance | PTH | ±0.075mm | Aperture tolerance of metal holes |
| NPTH | ±0.05mm | Diameter Tolerance for Non-Metallic Holes | |
| Inner Layer Minimum Line Width/Line Spacing | 0.5oz | 3/3mil | |
| 1oz | 3.5/3.5mil | Local minimum 3/3mil can be produced | |
| 2oz | 6/6mil | Local minimum 5/5mil can be produced | |
| Minimum Line Width/Line Spacing of Outer Layer | 1oz | 3.5/3.5mil | Local minimum 3/3mil can be produced |
| 2oz | 6/6mil | Local minimum 5/5mil can be produced | |
| Minimum Via (Via) Ring | 3.5mil (Single Side) | Increase the protection area of the via solder ring to the hole | |
| With the larger, the product is more reliable for long-term use | |||
| Line Tolerance | ±15% | ||
| BGA Pad Diameter | ≥0.2mm | BGA does not affect fees | |
| Minimum BGA Pad Center Distance | 0.45mm | ||
| Plating Thickness (Micro Inches) | Chemical Nickel Gold | Nickel Thickness: 100-200 | |
| Gold Thick: 1-3 | |||
| Gold Plating | Nickel Thickness: 100-200 | ||
| Gold Thickness: 1-10 | |||
| Hole Copper Thickness | Mechanical Via | Minimum ≥20um | |
| Blind Hole | dimple≤15um | ||
| Buried Via | Minimum ≥20um | ||
| Copper Foil Thickness | Inner Layer | 0.5-2oz | |
| Outer Layer | 1-2oz | ||
| Solder Mask | Outer Layer | ≥1.5mil | |
| Solder Mask Bridge | Green oil: 3.5mil | ||
| Black oil, white oil: 5mil | |||
| Other inks: 4mil | |||
| Plug Hole | Plug Aperture | 0.2mm＜Aperture≤0.45mm | |
| Line etching word | Line Width/Word Height | ≥4mil/25mil | |
| Silkscreen Characters | |||
| Solder Mask Color | White, Black (Glossy, Matte), Blue, Green, Yellow, Red, etc. | ||
| Character Color | Black White | ||
| Biggest Size | Single and Double Panels | 500*600mm | |
| Multilayer Board | 400*500mm | ||
| Smallest Size | Length and Width | ≥10mm | |
| Gold Finger Bevel | Angle | 20°、30°、45° | |
| Angle Tolerance | ±5° | ||
| Depth Tolerance | ±0.15mm | ||
| Outline Tolerance | Regular Shape | ±0.15mm | |
| V-CUT | Angle | 20°、30° | |
| Maximum number of knives | ≤30 knives | ||
| Outline Width | 55mm≤length≤480mm | ||
| Impedance | Impedance tolerance | ±10% | |
| Test | Flying Probe Test | Not Limited | |
| Test stand Test | 14000 Points | ||
| Imposition, Concatenation | Zero Gap Imposition | Imposition is shipped, and the gap between the intermediate board and the board is zero | |
| Imposition with Gaps | The gap of the imposition with gap should be greater than 1.6mm, otherwise it will be difficult to edge the gong, which will affect the efficiency. | ||
| Stamp Hole Imposition | Stamp hole 0.5mm diameter, 0.3mm edge spacing | ||
| Conventional 5-7 holes in a group | |||
| Design Software | |||
| PADS | Copper Problem | The factory defaults copper in Hatch mode. It is recommended to note the copper plating method before placing an order. | |
| 2D Line | Effective lines cannot be placed in the corresponding layer as 2D lines, and Huaqiu Circuit does not process 2D lines. | ||
| Altium Designer Protel | Version | There is a missing element problem in the output gerber of different versions of Altium Designer. Please note the version number when placing an order. | |
| Board Foreign Object | If components are placed far away from the PCB board, the conversion process cannot be output due to too large size boundaries. | ||
| Window Problem | Please do not mistakenly place the windows of the Solder layer on the paste layer. Huaqiu Circuit does not deal with the paste layer. | ||
| Copper Problem | Fill copper, if there are too many Fill blocks, the output file block will be lost. Suggestion: Use Polygon Pour for copper. | ||
