Why is multilayer ceramic PCB harder to build?

With the increasing demands of electronic applications in terms of circuit complexity, our focus has been on attaining higher levels of PCB board integration to enable denser circuit layouts. However, due to their inherent fragility, the construction of multi-layer circuits using pure ceramic PCB (such as aluminum oxide and aluminum nitride) presents challenges. Currently, the FS technology only allows for the realization of single-layer and double-layer ceramic PCB boards. To address the need for multilayer ceramic PCB, we employ Rogers materials, a high-performance substrate material developed and produced by Rogers Corporation. This material is widely recognized for its exceptional signal integrity and thermal management properties. Now, let us delve into the complexities associated with constructing multilayer ceramic PCB and explore the implementation of multilayer Rogers ceramic PCB.

Manufacturing Challenges of Multilayer Ceramic Circuits

Material and Compatibility

Rogers Corporation offers a comprehensive selection of materials specifically designed for the construction of ceramic multilayer circuit boards. These boards exhibit distinct variations in dielectric constants, thermal conductivity, and dissipation factor values. Hence, electronic manufacturers must meticulously evaluate electrical and thermal requirements, as well as ensure compatibility with the manufacturing processes.

The multi-layer build process necessitates the use of materials for each layer that not only fulfill the required specifications but also exhibit effective adhesion during lamination and resilience throughout subsequent processing stages. The challenge lies in establishing robust interconnections between ceramic layers while upholding dimensional stability. Furthermore, discrepancies in the coefficient of thermal expansion between layers and components can give rise to reliability concerns, such as delamination or warpage during thermal cycling. To address these complexities, FS Technology will undertake a thorough assessment of materials and enhance lamination procedures to ensure optimal compatibility and adhesion.


The production of multilayer boards necessitates meticulous attention to detail and precise register accuracy. These boards often incorporate intricate fine-line circuits, complex designs, and densely packed interconnects. Additionally, drilling and milling operations are involved, which, if not handled with utmost care, can result in chipping or cracking due to the board’s inherent hardness. Moreover, achieving proper registration of multiple layers within tight tolerances can pose significant challenges. Failures in layer registration can give rise to signal degradation, impedance mismatches, and even complete circuit failures.


Another essential step in the PCB manufacturing process is metalization. In order to achieve reliable electrical performance, the conductive materials must adhere well to the ceramic surface. To ensure successful metallization on their ceramic substrates, Rogers Corporation offers specific materials and procedures. However, any variations in the cleanliness or surface roughness of the ceramic layers can significantly impact the quality of the metallization. Therefore, strict process controls and meticulous surface preparation techniques are essential to maintain high-quality metallization.

High Quality Multilayer Ceramic PCB Manufacturing

Collaboration with Material Suppliers

If your project requires a substantial and continuous supply of materials, it is highly recommended to establish a long-term collaborative partnership with Rogers Corporation. This strategic approach not only eliminates the involvement of intermediaries but also allows you to leverage their extensive expertise and in-depth knowledge of their products. Their profound understanding enables them to offer invaluable advice and assist you in selecting the most suitable substrates for your specific requirements.

Additionally, choosing a reputable PCBA company like FS Technology can prove advantageous. Our team of experts possesses a comprehensive understanding of material properties, including dielectric constant, thermal conductivity, and dissipation factor. Through years of hands-on experience, we have identified materials that effectively meet the electrical and thermal characteristics necessary for circuit board design. Furthermore, we possess the capability to provide training and technical support, aiding customers in optimizing the lamination process and enhancing layer compatibility.

Compared to Rogers Corporation, FS Technology’s multilayer ceramic PCBA service offers a more cost-effective solution without compromising on quality.

Advanced Manufacturing Techniques

Achieving accuracy and precise positioning in the production of multilayer ceramic PCB requires advanced equipment, such as the implementation of FS technology utilizing plasma etching or laser drilling. Now, laser drilling and controlled depth milling have emerged as standard processes for accomplishing precise drilling and milling operations. Laser drilling ensures high precision while minimizing the risk of chipping or cracking the ceramic material. Controlled depth milling allows manufacturers to achieve the desired depth with utmost precision, ensuring the integrity of the ceramic layer while facilitating the creation of essential interconnects.

Moreover, upon completion of the multilayer ceramic PCB board, optical alignment technology and automated vision systems are employed to verify the alignment of the layers. This meticulous verification process significantly reduces the possibility of signal degradation or circuit failure caused by misalignment. By utilizing optical alignment and automated vision systems, manufacturers can ensure the precise alignment of the layers, thereby enhancing overall performance and reliability.

Continuous Process Optimization

In order to effectively minimize the failure rate of ceramic multilayer circuits, it is imperative to engage in continuous optimization of both the design and production processes. Manufacturers must first conduct thorough testing and analysis to identify any potential issues and implement necessary corrections. Additionally, optimization of the production process involves fine-tuning variables such as laser drilling settings, lamination temperature profiles, and metallization deposition environments.

Manufacturers can achieve increased process yield, enhanced product performance, and reduced error rates through systematic experimentation and comprehensive data analysis. By meticulously examining and adjusting various parameters, they can identify the optimal settings and conditions that lead to optimal outcomes. This iterative optimization process not only ensures the production of reliable and high-quality ceramic multilayer circuits but also facilitates ongoing improvement and innovation in the manufacturing process.

Benefits of Using Ceramic Multilayer PCB

  • High frequency and low loss: Rogers substrate materials are purposefully engineered to serve as substrates for multilayer ceramic circuits, delivering exceptional performance in high frequency electronics.
  • Thermal management: Ceramic boards are renowned for their excellent thermal conductivity. Leveraging ceramic boards effectively dissipates heat generated by high-power components, mitigating temperature stress, minimizing the risk of component damage, and enhancing the longevity of electronic equipment.
  • Miniaturization potential: These ceramic PCBs enable compact and space-constrained designs through the implementation of multilayer circuits. With their high-density interconnects and fine-line traces, more components can be seamlessly integrated within a smaller footprint. This miniaturization potential proves particularly advantageous in applications necessitating reduced size and weight.

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