The fusion of aesthetics and performance is crucial for securing your product’s market share. The design of the outer casing is intrinsically tied to its aesthetic appeal, while high-quality circuit boards are integral to its performance. With a rich history of providing PCB manufacturing services to electronic manufacturers, FS Technologies offers cutting-edge manufacturing, assembly, inspection, and testing capabilities, as well as a customer-centric approach that caters to your technical requirements and business objectives. If you aim to achieve higher returns at lower costs, please feel free to explore our website to discover how our team at FS can assist you. Alternatively, you can contact us to arrange a consultation with our engineers and business experts for more in-depth discussions.
PCB Manufacturing in China
Who we are
Founded in 2004, FS Technology has been a reliable provider of electronic manufacturing services to global customers, including PCB Fabrication. Although this may be your first time visiting our website, we have been operating for a significant amount of time. If you have used Alibaba, chances are you may have already heard of us. As our team continues to grow, more talented individuals are joining the FS family, including sales professionals, technical experts, and workers, with a total of 1,300 employees. They are capable of addressing all your manufacturing needs, from prototyping to mass fabrication, while ensuring quality compliance and cost-effectiveness. At FS Technology, we are committed to meeting the technical requirements of each customer and adhering to quality standards and certifications.
Why we are the best
- Professional Services: From design to delivery, there is a person in charge to manage your project.
- Stringent Fabrication Processes: Our production line features multiple inspection points and our operators strictly adhere to rigorous quality management regulations to ensure the highest level of quality.
- Advanced Equipment: Deburring machine, double-sided alkaline etching machine, metal chemical cleaning machine, etching production line…
- Large Production Capacity: FS Technology operates factories in both Shenzhen and Huizhou, with a combined capacity of over 500,000 units.
- No Minimum Order Quantity: Offer prototyping services with no minimum order quantity requirement, ensuring that even small-scale projects receive the same meticulous attention to detail as our larger orders.
- Competitive Pricing: Our focus on long-term partnerships and a win-win approach allows us to provide cheap PCB fabrication services without compromising on quality.
Bare Board Production
Our PCB Manufacturing Capabilities
Drawing on our robust Fabrication capabilities, we have successfully assisted numerous clients in the past, tackling common design challenges and facilitating large-scale production. Our exceptional technology and services have garnered us several prestigious printed circult board projects across a diverse range of industries, including aerospace, marine, military, industrial, automotive, and security. Our comprehensive capabilities are listed below:
General Parameters
| Manufacturing Materials | Capability |
|---|---|
| FR4 | Tg 135: KB6160, S1141 Tg 150: KB6165, S1000H Tg 170: KB6167, S1000-2M, IT180A, TU768 |
| Halogen Free FR4 | Tg 150: S1150G Tg 170: S1165, TU862HF |
| Ceramic Filling High Frequency Material | Rogers 4003C/4350B |
| PTFE High Frequency Material | Rogers Series, Arlon Series, Taconic Series, F4BM Series |
| Special PP | NFPP: Arlon 49 N, VT47 Ceramic Filling PP: Rogers 4450F PTFE PP: Arlon 6700, Taconic FR-27 |
| Rigid PI Material | Arlon 85 N, VT901 |
| Metal Base Board | Bergquist Al base, Chinese Brand Al base, Copper base |
| Material Mixed Laminate | 4 layers – 10 layers (FR4 + Ro4350, FR4 + Aluminium, FR4 + FPC) |
| Note | Other special materials can be processed and produced by means of customer supply or purchasing. |
| Item | Standard | Advanced | Innovative |
|---|---|---|---|
| IC Space (Green Color) | 4 | 4 | 3 |
| IC Space (Other Color) | 5 | 5 | 4 (blue oil) |
| Liquid Photoimageable (LPI) Solder Mask Registration | 3mil | 2mil | 1.5mil |
| Thickness T＞1.0 mm | ±10% | ±10% | ±8% |
| Tolerance T≤1.0 mm | ±0.1 | ±0.1 | ±0.1 |
| Board Thickness (mm) | 0.5-5.0 | 0.4-6.5 | 0.25-10 |
| Hole Aspect Ratio | 10:01 | 12:01 | 20:01 |
| Via Size For Plug Solder Mask | 0.25-0.5 | 0.20-0.5 | 0.15-0.6 |
| Via Size For Plug Resin And Capped Copper | 0.25-0.5 | 0.20-0.5 | 0.075-0.6 |
| Panel Size (mm) | 457×609 | 457×609 | 600×1000 |
| Bow And Twist | ≤0.75% | ≤0.75% | ≤0.5% |
Inner Graphics
| Item | Basic copper thickness | Line Width/Space |
Minimum inner line width distance | 1/3 OZ | 2.7/2.7 |
| 0.5 OZ | 3/3 | |
| 1.0 OZ | 3.5/3.5 | |
| 2.0 OZ | 5/5.5 | |
| 3.0 OZ | 6/7.5 | |
| 4.0 OZ | 7/11.5 | |
| 5.0 OZ | 10/16 | |
| 6.0 OZ | 10/10.5 | |
| 10 OZ | 18/20 | |
| 12 OZ | 22/24 | |
Hole to Line Spacing | 4 layers | ≥6mil(1 core) |
| 6 layers | ≥7mil(2 core) | |
| 8 layers | ≥7mil(3 core) | |
| 10 layers and above | ≥8mil | |
| Line Width/Space Accuracy | Non-impedance plate ±20%; Impedance plate ±10% | |
| Alignment accuracy | ±25um（CCD） | |
Outer Graphics
| Item | Basic copper thickness | Line Width/Space |
Minimum outer line (mil) | 1/3 OZ | 3/3 |
| 0.5 OZ | 3.5/3.6 | |
| 1.0 OZ | 4/4.4 | |
| 2.0 OZ | 5/5.5 | |
| 3.0 OZ | 6/7.5 | |
| 4.0 OZ | 14/12 | |
| 5.0 OZ | 18/17 | |
| 6.0 OZ | 13/11 | |
| 10 OZ | 16/26 | |
| 12 OZ | 24/32 | |
The minimum line width of the outer etched word | Base Copper H OZ; 8mil | |
| Base Copper 1 OZ; 10mil | ||
| Base Copper 2 OZ; 12mil | ||
| Line Width/Space Accuracy | Non-impedance plate ±20%; Impedance plate ±10% | |
| Alignment accuracy | ≤24um（LDI） | |
Hole Processing
| Item | Mass Production | Prototyping | |
Through Hole | Hole Diameter (max) | 6.5mm, thickness <6.4mm | Greater than 6.5mm (hole expansion process) |
| Hole Diameter (min) | 0.15mm，thickness<1.0mm | 0.15mm, thickness<1.6mm | |
| Hole tolerance | NPTH±0.05mm, PTH hole±0.075mm, crimping hole±0.05mm | ||
| Hole tolerance | ±0.05mm | ||
| Thickness ratio | 8:01 | 20:01 | |
| Minimum Hole Spacing | The same grid > 8mil; non-same grid ≥ 12mil | The same grid ≥ 6mil, not the same grid ≥ 10mil | |
Deep Hole Control | Minimum depth control hole diameter | 0.155mm | |
| Depth Control Accuracy | 0.1mm | 0.05mm | |
| Hole Depth Thickness Diameter Ratio | ≤0.6:1 | ≤0.8:1 | |
| Control depth groove depth tolerance | ±0.15mm | ±0.1mm | |
Stepped Hole | Step hole diameter tolerance | 0.1mm | 0.05mm |
| Step hole depth tolerance | 0.2mm | 0.1mm | |
Laser Hole | Laser Hole Copper | ≥10um | |
| Hole Diameter range | 0.1mm-0.15mm | 0.076mm-0.15mm | |
| Laser blind hole thickness to diameter ratio | ≤0.6:1 | ≤0.8:1 | |
| Outer line width and line spacing | 3.5/4mil | 3.5/3.5mil | |
| Inner line width and line spacing | 3.0/3.5mil | 3.0/3.3mil | |
| Laser Blind Hole Medium Thickness | 2.5-4mil | 2.5-5mil | |
Back Drilling | Depth Tolerance | ±0.1mm | |
| Position Tolerance | ±0.1mm | ||
| Hole to outer line distance | ≥0.15mm | ≥0.125mm | |
| Hole to inner line distance | ≥0.175mm | ≥0.15mm | |
Countersunk Hole | Countersunk drill diameter | The 45° countersunk bit has a diameter of 4.5mm | |
| 60°, 82°, 90° countersunk bit diameter is 6.35mm | |||
| 100° countersunk bit diameter is 6.5mm | |||
| Outer Aperture Accuracy | ±0.2mm | ||
| PTH Countersunk Ring Width | 8mil | ||
| PTH countersunk hole distance line | 12mil | ||
Conical Hole | Opening Tolerance | ±0.2mm | |
| Aperture angle | 45°、60°、90° | ||
| Slot | Minimum Slot | 0.5mm | |
Outline
| Item | Mass Production | Prototyping | |
V-CUT | Angle | 20°、30°、45°、60° | |
| Jumping Knife Distance | ≥8 mm | ||
| Board Thickness | 0.4 mm-3.0mm | ||
| Thickness accuracy | ±0.1 mm | ±0.05 mm | |
Gong Board | Minimum gong cutter diameter | 0.6 mm | |
| Control deep gong plate thickness | ≥0.4 mm | ||
| Depth tolerance of deep gong plate | ±0.15 mm | ±0.1 mm | |
| Tolerance of deep gong plate size | ±0.13 mm | ||
Hypotenuse | The outer layer of the top of the gold finger is copper | Bevel depth +0.2 mm | |
| The inner layer of the top of the gold finger is copper | Bevel depth +0.4 mm | ||
| Angle (tolerance ±5°) | 20°, 30°, 45°, hypotenuse angle is usually 30° | ||
Surface Treatment
| Item | Standard | Advanced | Innovative | |
ENIG | Nickel Thickness (um) | 2.0-5.0 | 3.0-5.0 | 3.8-7.62 |
| Gold Thickness(uinch) | 1.0-2.0 | 2.0-3.0 | 3.0-5.0 | |
Hard Gold (Au Thickness) | Normal Golden Finger（um） | 0.15 | 0.8 | 3.0 |
| Selective Hard Gold (um) | 0.15 | 0.8 | 2.0 | |
ENEPIG | Nickel Thickness (um) | 2.0-5.0 | ||
| Palladium Thickness(uinch) | 4.0-20.0 | |||
| Gold Thickness(uinch) | 1.0-5.0 | |||
Plating Gold | Nickel Thickness (um) | 2.0-7.62 | ||
| Gold Thickness(uinch) | 1.0-5.0 | |||
| Immersion Tin | Tin Thickness (um) | 0.8-1.2 | ||
| Immersion Silver | Sliver Thickness (um) | 0.15-0.4 | ||
| OSP (um) | 0.2-0.6 | |||
| Tin Lead HASL (um) | 2.0-40.0 | |||
| Lead Free HASL (um) | 2.0-40.0 | |||
| Note：Tin Lead /LF HASL panel size should less than ≤500×600 mm，thickness≥0.6 mm；Hard Gold panel size≤400×500 mm，the other surface treatment panel size less than 500×900 mm | ||||
Special Process
| Item | Standard | Advanced | Innovative |
|---|---|---|---|
| Back Drilling | YES | YES | YES |
| Heavy Copper PCB with Blind/Burried Via | YES | YES | YES |
| Step Slots | YES | YES | YES |
| POFV | YES | YES | YES |
| Plated Half Holes/Edge Plating | YES | YES | YES |
| Hybrid Material Lamination | YES | YES | YES |
Delivery Ability
| 1-2L Lead-time | Sample Expedited 24 hours and 48 hours, Normal2-5 days, Mass production 5-7days |
| 4- 8L Lead-time | Sample Expedited 48 hours 72 hours, Normal 5-7days,Mass production 7-10 days |
| 10-18L Lead-time | 10-15 days,Special circumstances based on the actual PCB design |
| More than 20L Lead-time | 15-20 days ,Special circumstances based on the actual PCB design |
| Acceptable File Format | ALL Gerber Files、POWERPCB、PROTEL、PADS2000、CAD、AUTOCAD、ORCAD、P-CAD、CAM-350、CAM2000 etc. |
High Quality PCB Fabrication
When searching for a PCB bare board manufacturer, customers typically seek a supplier that can offer high-quality electronics PCB manufacturing while adhering to strict manufacturing standards. By selecting FS Technology, you can be assured that you can focus your attention on your core business of selling products, while we leverage our advanced technology and expertise to manufacture precise and reliable printed circuit board for your products.
Meet International Standards
At FS Technology, ensuring quality assurance at the outset of every project is always our top priority. To achieve this, we adhere to internationally recognized authoritative standards and third-party certifications, such as ISO, UL, RoHS, and IPC.
To cater to the diverse needs of our clients, we have obtained a series of certifications including ISO9001, ISO 14001, ISO/TS16949, and ISO13485. These certifications signify our capability to manufacture circuit board for various industries, such as consumer electronics, medical electronics, and automotive electronics, among others.
With our commitment to upholding the highest quality standards and certifications, our clients can be confident that they are partnering with a reliable and trustworthy printed circuit board bare board manufacturer.
Internal Audit System
In addition to external certifications and qualifications, we have implemented internal quality control standards and review systems that surpass industry standards. Over the past 20 years, we have reflected on past service deficiencies, created and updated review standards, and applied them to all stages of our company’s development and growth. We are confident in the quality of our circuit board manufacturing.
Our review system covers all stages involved in PCB board manufacturing, and all personnel in each workstation adhere to our strict quality control standards. These include program file inspection, declaration of conformity, static control process, quality management manual, manufacturing schedules, production record filing, material inspection specifications, and specific/standardized work instructions. We maintain real-time communication throughout every step of the manufacturing process, from circuit board selection to factory inspection, allowing us to implement any changes in customer requirements and continuously monitor fabrication progress.
Furthermore, our well-trained technical team with decades of experience in the printed circuit industry is available 24/7 to assist you. They work closely with you to resolve any outstanding issues, detect any potential issues during the PCB manufacturing process, and update your product development. Our aim is to optimize PCB fabrication price with FS Technology.
How is PCB produced?
While the specifics of PCB production may vary based on factors such as the type of board and the manufacturer, the fundamental concept and process remain the same. This involves translating the required circuit into the physical structure of the printed circuit board to create a bare board.
- Document Review
- Cutting
- Imaging
- Inner Layer Etching
- Inner AOI Inspection
- Layups
- Hole Drilling
- Hole Metallization
- Plating
- Outer Circuit Manufacturing
- Graphic Plating
- Outer Layer Etching
- Outer AOI Inspection
- Solder Masking
- Silkscreen Application
- Finishing
- Product Testing
- Profiling
- Packaging and Storage
Manufacturing Document Review
Upon receiving the design files and requirements, FS Technology’s experienced engineering team will conduct a thorough review of your circuit design, schematic diagram, and any supporting manufacturing documents, prior to the formal fabrication of the PCB. This comprehensive review is beneficial in ensuring the success of the project, and can help avoid potential issues or failures downstream, thereby increasing the efficiency of the production schedule.
Once the review is complete, our team will provide a price list as soon as possible based on your specific needs. Upon agreement of the details of the cooperation, our professional service will begin.
CCL cutting
The substrate material (copper clad laminate) is cut into the desired shape using a cutting machine at FS Technology. This process is automated, with the operator inputting the basic data of the PCB into the machine to ensure precision and accuracy. Once cut, the boards undergo additional processing such as sanding and baking to prepare them for the next stage of the manufacturing process.
Imaging
Imaging refers to the process of transferring images onto thin film layers by exposing them to ultraviolet light to form traces. In the case of multi-layered PCBs, FS Technology employs Laser Direct Imaging (LDI) technology, which utilizes a tightly focused laser beam to accurately reproduce the circuit design onto the board.
Inner layer etching
Etching is a precise process used to remove excess copper from the PCB. To prevent any unintentional trace etching, FS Technology applies a photoresist during imaging, which acts as a protective layer for the sensitive areas and traces during the etching process. After etching is completed, the photoresist layer is removed.
Inner AOI inspection
Upon completion of the fabrication of the inner layer circuit, it is subjected to AOI (Automated Optical Inspection) to verify its integrity. This inspection method utilizes optical principles to detect defects in the circuit board manufacturing and is considered one of the most reliable methods.
Layer Stackup
Layer stacking is a process that is employed in the production of multilayer PCB. This process involves aligning, bonding, and laminating multiple inner layers, which are composed of various materials. The layer stacking process is conducted under high temperature and pressure, with precise control via software. Conversely, this process is not utilized in the production of single-layer PCB.
Hole Drilling
The primary purpose of manufacturing a PCB is to assemble it into a complete PCBA board. To achieve this goal, it is necessary to create holes of varying types, such as microvias, buried holes, and blind holes, as well as component and mechanical holes and other slots on the board. To accomplish this, it is essential that the machine’s parameters be programmed based on the customer’s specifications. Notably, FS Technology employs laser drilling to enhance the efficiency of PCB manufacturing.
Hole metallization
The process of hole metallization is critical to achieve electrical conductivity between layers of a PCB, which is essential for carrying components. Two commonly used technologies for hole metallization include plated through hole (PTH) and black hole plating.
PTH involves a chemical redox reaction where a layer of copper is deposited onto the hole. This process offers flexibility in adjusting plating parameters such as thickness and is widely used in the production of industrial control boards.
Black hole plating, on the other hand, entails coating the hole surface with graphite or black carbon powder to form a conductive layer. This is a low cost PCB manufacturing method.
Plating
The process of copper deposition involves the application of a conductive material onto the rigid PCB to establish conductivity within the board’s holes or vias, as well as providing an electrical connection/bonding between the multiple layers of the PCB. The holes or vias are filled with copper, forming conductive walls that allow for electrical interaction between components and the board circuitry.
Outer Circuit Manufacturing
The manufacturing process for the outer layers of a PCB shares some similarities with that of the inner circuit fabrication. However, there is a key difference in that dry film lamination is specifically required for outer layer circuit fabrication, and the type of laminate used differs from that used in the inner layers to accommodate for any design requirements that may vary.
Graphic plating
This is a secondary plating process (also known as pattern plating) which is typically done after the dry film lamination process (previous step) is carried out to plate the additional dry film parts. Before graphic plating is performed, the surface of the board needs to be prepared with a variety of treatment methods which includes surface degreasing, micro-etching, and acid pickling treatment. Due to copper being applied during the first plating process, a layer of tin is now added to prevent the plated, exposed copper from oxidizing and to protect all of the necessary conductive material from being removed during outer layer etching.
Outer layer etching
Similar to inner layer etching, the removal of excess copper is done at this stage but is done to the outermost layer of the circuit board. Since the outer layer is pre-plated with a copper film during hole drilling and electroplating, there is typically a thin layer of tin or lead that protects areas of the copper that is used for the board traces & pads. Outer layer etching will remove the excess copper without damaging the necessary copper layers underneath the tin/lead layer for the electrical connection of components.
Outer AOI
Achieving optimal Fabrication quality while managing costs is a top priority for engineers. Addressing this challenge, we offer Automated Optical Inspection (AOI) testing as a reliable method to ensure superior quality throughout the production process, from inner layer and outer layer fabrication to PCB assembly. AOI system utilizes advanced cameras and scanners, complemented by cutting-edge software algorithms, to meticulously detect physical manufacturing defects. Unlike other inspection methods, AOI does not require additional financial investment, resulting in reduced PCB fabrication costs.
Solder masking
By applying a thin coating on the outer solderable surfaces of the circuit board, this layer helps to prevent oxidation of the copper and provides isolation of conductive materials that are close in proximity to each other to avoid arcing.
Silkscreen application
Printed silkscreen layer in the final stage of PCB board production. This layer plays a vital role in identifying the components, logos, text, and other visually distinguishable elements on the printed circuit board.
Customized screen printing offers a range of benefits, both aesthetic and functional. It not only enhances the visual appeal of your PCB circuit but also facilitates efficient assembly processes. By utilizing advanced inkjet printing technology, we ensure precise and accurate placement of the silkscreen layer.
Finishing
Selecting the right surface finish to safeguard copper traces and sensitive areas on your printed circuit board, ensuring their longevity and performance in various handling and environmental conditions.
At FS Technology, we take pride in offering comprehensive and tailored surface finishing services that cater to your unique requirements. Our range of surface finishing options includes tin-lead HASL, lead-free HASL, OSP, immersion silver, immersion tin, ENIG, hard gold, chemical nickel plating, ENEPIG, and more.
By choosing FS Technology’s PCB production service, you gain access to a wide array of surface finishing solutions. Our team of experts can guide you in selecting the most suitable finish based on your board’s application and compatibility with the components used.
Product testing
Testing is a critical post-production step that ensures proper functionality and production of the product before it is sent out to customers and this is done by both specialized equipment and expert in-house engineers that perform a thorough testing process. Some PCB testing methods used may include in-circuit testing, visual inspections, flying probe testing, AOI, functional testing, automated x-ray inspection, burn-in testing and other more specific tests (depending on the board application). With the series of tests conducted, the PCB products will be tested for any shorts, component issues, incompatibility during production, physical defects, soldering errors, overall board function, etc before it is shipped out to customers.
Profiling
In order to meet the products’ dimensional requirements (specific sizes & shapes of the boards), profiling is carried out to mechanically form a small rectangular cut through the board so that the PCB can be separated from the production panel and into individual panels (according to the dimensional requirements). There are three main types of profiling: milling/routing, V-scoring and punch profiling. Except for punch profiling, the two other methods utilize a very specific CNC machine to make the cuts, whether it is a rectangular cut (milling) or a triangular cut (V-scoring). Punch profiling, on the other hand, is a much more efficient method as it makes use of a punch machine to craft a standard hole in the circuit board.
Packaging and storage
After the manufacturing and testing process takes place, the products are packaged safely using a variety of packing materials (bubble bags, electrostatic bags, vacuum packs, etc.) to prevent any static & physical damage to the finished product during shipping/transportation.
Summarize
This page provides details of FS Tech’s PCB manufacturing capabilities and production process and summarizes them here:
- Available PCB Types: We specialize in manufacturing 1-58 layer circuit boards, including rigid, flexible, and rigid-flex variations. Our expertise covers a wide range of materials, such as Nelco, Teflon, Arlon, Taconic, Aluminum, FR-4, and Rogers. We excel in producing HDI, RF, and high-frequency circuits.
- Material Mixed Laminate: We offer innovative material combinations, enabling the creation of 4-layer to 10-layer laminates such as FR4+Ro4350, FR4+Aluminium, and FR4+FPC.
- Comprehensive Services: Our services encompass design, modification, manufacturing, assembly, testing, packaging, shipping, and conformal coating. Whether you require prototyping, small batch production, or high-volume manufacturing, we have the capabilities to meet your needs.
- Manufacturing Advantage: As one of the leading PCB fabrication vendors in China, we deliver large output capacity at competitive prices with rapid turnaround times. We offer both turnkey PCB manufacturing and semi-turnkey services, providing you with flexibility and convenience.
- Online Quotation: While we currently do not provide an online quotation service, we encourage you to reach out to our sales team via email. Our dedicated sales representatives will promptly respond to your inquiry and provide you with a comprehensive price list within 2-3 business days.
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