PCB & PCBA Quality Control Measures

How does FS technology control production quality

品質管理

FS Technology firmly believes that quality control is best achieved through lean management and strict attention to detail. Our ability to stand out among many PCBA companies is a result of our rigorous quality control methods and their strict implementation. Compared to other EMS service providers, we place special emphasis on several core processes that they tend to overlook and use a “key process quality control mechanism” to ensure their proper management. These processes are critical throughout the entire manufacturing process, and if not well-controlled, can compromise the quality of the final product. Contact us now to learn more about our QC process!

Quality Control Methods

QC Process	Items Checked
IQC	— PCB: Thickness, vias, pads, silkscreen, warping degree, circuits, soldermask, etc; — Components: Part-number, quantity, value, RoHS, appearances, solder pins, temperature resistance, etc;
ストレージ	— Sensitive components: stored in a relative humidity 5% cabinet; — RoHS components: labeled with RoHS or Non RoHS remarks after IQC process; — Solderpaste: sealed and stored in a 2-10℃ refrigerator, labeled with expiration date; — Material identification card;
ソルダーペースト	— Choosing famous solderpaste brands like ECO, Alpha, Vital; — Applying automatic solder paste mixing machine to stir clockwise for 2-5 minutes until the solder paste reaches a filamentous state and immediately use for production; — Using famous brand laser stencil and paying highly attention to the high precision solder pads like QFN, BGA, etc; — Controlling solderpaste thickness, area, volume distribution with 3D SPI and non-contact laser 3D scanning intensive sampling technology;
SMT Soldering	— Having 8 automatic Pick&Place production lines with Samsung SM471/482/481, Fujifilm CP8/6 series, electric feeders; — Supporting common IC, BGA, QFN, PLCC, and other components of precision package components assembly; — Having a reflow oven with 10 temperature zones to leave more time for solderpaste melting and solidification, making sure the temperature rising and dropping more steadily; — Using AOI equipment at the end of every production line to automatically scan PCB through the camera and collect images to compare the actual solder joints with the qualified images in the database; — Having X-ray equipment to check the soldering quality for BGA chips; — Conducting the first article inspection before running the rest of production;
Assembly Inspection	— Maintaining real-time communication with the client to translate all instruction requirements for the engineer; — Training and guiding the testers until they can understand all steps and operate independently; — Sharing the test operation steps and test results with the customer through a video record for confirmation and archiving; — Proceeding with 100% products after the test result is confirmed by the client; — Recording failure test results and informing how to resolve them and as a basis for future design improvements;
パッケージ	— Carefully packing PCBA board with bubble bags, pearl cotton, electrostatic bags, and vacuum bags before transportation to prevent damage caused by static and crushing;