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DIP Package: A Comprehensive Guide to the Dual In-line Package

In the early stages of circuit systems, an circuito integrato (IC chip) was commonly encased in diverse proprietary packages, resulting in challenges with component interchangeability and impeding large-scale production. Recognizing this issue, Fairchild Semiconductor took a significant step in 1964 by introducing the concept of the Pacchetto DIP. Questo standardized packaging solution for IC was initially developed as a 14-pin package, catering to the requirements of small-form-factor integrated (SSI) devices. FS Technology aims to provide a comprehensive explanation of this packaging form to assist you with your PCBA project.

DIP Package Overview

The Evolution of DIP Packaging

The DIP evolved as the next innovation after the “TO” packages and the more unreliable “flat packs.” The development of the DIP should go down through the credits of Fairchild Semiconductor and Bryant “Buck” Rogers of the United States of America in the year 1964. The DIP offered an ease of automation of assembly and testing that marked a major breakthrough. Before the advent of surface-mount technology (SMT), the DIP remained the leading technology of IC packaging throughout the 1970s and the early 1980s that powered the first wave of the home computers and various industrial machines. Though its supremacy may have diminished with the growth of Tecnologia SMT, its valuable application still prevails.

Naming Rules and International Standards

DIP packages are standardized by organizations across the world such as JEDEC (Joint Electron Device Engineering Council) and IPC (Association Connecting Electronics Industries). The standard names of these packages take the form of “DIP-n,” with ‘n’ being the total pin numbers. A typical timer IC called the “555 timer” comes with an 8-pin layout called DIP-8. JEDEC specifications (ref. MS-001) contain the details of the precise dimensions of the packages.

What is a DIP (Dual Inline Package)?

DIP is the abbreviation of the dual inline package, also referred to as DIL (Dual In-Line), and is a standardized packaging format used for electronic component packaging, particularly for integrated circuits and other electronic devices. It consists of a rectangular shell with two rows of parallel electrical connection pins. In the PCBA industry, different countries may have varying technical terminology. In China, for example, the assembly method involving plug-ins is referred to as Assemblaggio DIP rather than Assemblaggio THT.
 
DIP IC packages find widespread usage in various electronic components within PCBA projects, including microcontrollers, memory chips, operational amplifiers, and digital logic ICs. They provide a convenient and reliable means of connecting IC chips to printed circuit boards.

What is DIP Assembly?

Assemblaggio DIP entails the produzione di massa of solder connections by immersing a PCB with mounted components into a tin pot. The package’s pins are arranged in parallel, facing downward and protruding from the bottom plane of the package. Sufficient pin length is provided to enable insertion through holes in the PCB and subsequent soldering on the other side. This process typically follows SMT, thus Componente DIP soldering is also referred to as “DIP soldering” or “DIP post-soldering.”
 
This packaging method is commonly employed for small to medium-sized integrated circuits, typically with around 100 pins. CPU chips packaged in DIP format feature two rows of pins that need to be inserted into the DIP chip socket. Alternatively, they can be directly inserted into a circuit board with corresponding solder holes. Care must be taken when plugging and unplugging chips with DIP PCBA technology to avoid damaging the pins.

DIP Package Structure and Characteristics

Basic Components of DIP Package

A typical DIP package comprises the following:
  • Body: The packaging material that insulates the silicon chip below consists of epoxy plastic (PDIP) or ceramic (CDIP).
  • Leads/Pins: Two rows of parallel tin or gold-plated pins that offer both mechanical and electrical continuity.
  • Keying Notch: A small notch or dot on one corner of the chip package that identifies the orientation of Pin 1.

Pin Arrangement and Common Specifications

Pin numbers are assigned sequentially in a counterclockwise manner, beginning with the pin next to the keying notch. Various pin numbers used are 8, 14, 16, 18, 20, 28, and 40; of these, the most common packages are DIP-8 e DIP-14.

Standard Dimensions

The determining dimension here is the pin pitch, the length of the centre-to-centre span between the pins. This dimension must remain at the standard of 0.1 inches (2.54 mm) on every standard DIP package. The row spacing, the length of the centre-to-centre span across the rows of pins, depends on the pin count, but again on an increment of multiples of 0.1 inches.

Thermal Characteristics

Packages of the DIP type tend to have higher thermal resistance than the more modern packages. Heat transfer occurs via the pins into the PCB and then through the rest of the package. Some may incorporate a radiatore if the application requires more power.

Electrical Performance Advantages

The relatively strong, lengthy pins of the DIP packaging type contribute significantly to the mechanical strength of the package and its resistance to temperature and mechanical stress. The DIP-type packaging also supports relatively low parasitic inductance levels that may compare favorably with tiny SMD packages.

Common Types of DIP Packages

Types of dip package

PDIP

Componente PDIP
PDIP, short for “Plastic Dual In-Line Package,” is a type of packaging utilized for electronic components. The primary material used in PDIP is plastic, offering excellent electrical insulation properties, as well as the benefits of lightweight construction and cost-effectiveness. These attributes contribute to enhancing the reliability of PCBA boards. Thermosetting plastics such as epoxy or phenolic resins are commonly employed as plastic materials in PDIP packaging.

SPDIP

SPDIP component size
Il termine "SPDIP” stands for “Shrink Small Outline Package,” also known as “Shrink Plastic Dual Inline Package.” It represents an advancement over the conventional DIP chip package, is a widely used packaging style for integrated circuits. The key distinction between DIP and SPDIP lies in their size. SPDIP packages have reduced physical dimensions, enabling greater component density on circuit boards and efficient space utilization. As a result, SPDIP offers improved miniaturization while maintaining the functionality and performance of the IC.

SDIP

SDIP to DIP adapter
SDIP, which stands for “Shrink Dual Inline Package,” is an IC package type that shares similarities with the SPDIP package but features a smaller physical size. SDIP packages possess a rectangular shape with two rows of pins or leads positioned along the longer sides, much like SPDIP packages. However, SDIP packages are specifically designed to be more compact, enabling higher component density and optimal utilization of board space. This reduction in size contributes to increased efficiency and miniaturization in electronic designs.

CerDIP

CerDIP components
Il CerDIP (Ceramic Dual Inline Package) represents a specialized variant of the DIP package integrated circuits format, distinguished by its utilization of ceramic material instead of plastic. The CerDIP package is particularly suitable for ICs that demand heightened reliability, exceptional thermal performance, or robust resistance to adverse environmental conditions.

Metal DIP

Metal DIP components
The term “Metal DIP” is not widely recognized in the electronics industry and does not represent a specific package type or standard. However, based on its name, it could allude to a DIP PCB package that incorporates metal components or features.
 
Traditional DIP packages typically consist of a plastic or ceramic body with metal leads or pins. These pins or leads are commonly crafted from metal alloys like copper or steel, providing electrical conductivity and mechanical stability. However, the primary body of the package is typically composed of plastic or ceramic materials.
 
It is important to note that there are variations of DIP that incorporate metal components or features for specific purposes, such as enhancing thermal performance or providing electromagnetic shielding. Here are a couple of examples:
 
  • Metal-Clad DIP: In certain cases, a DIP PCB assembly may integrate a metal heat sink or a metal layer affixed to the top of the plastic or ceramic body. This metal layer aids in dissipating heat generated by the integrated circuit, thereby improving its thermal performance.
  • Shielded DIP: Specific DIP may incorporate metal shielding, often in the form of a metal can or cover, to offer electromagnetic interference (EMI) shielding. This shielding helps mitigate the transmission or reception of electromagnetic signals that could potentially interfere with the operation of the integrated circuit or surrounding components.
 
These variations should be understood as modifications to the conventional DIP design, designed to enhance specific characteristics or meet particular application requirements, rather than representing standard dual in-line packages.

Pros & Cons of DIP

Vantaggi:

  • Prototipazione & Breadboarding Friendly: The big pin pitch makes the IC ideal for breadboarding; thus, it’s the IC of preference when it comes to education and development projects.
  • High Mechanical Strength: The through-hole mounting offers a very strong mechanical attachment to the board and thus suits applications that involve vibration and stress.
  • Ease of Repurposing/Repairing: Chips can easily be removed and replaced with the help of human assembly skills. This makes debugging or small-scale production extremely easy.
  • Proven Reliability: Its track record of deployment under harsh conditions proves its reliable nature.

Svantaggi:

  • Larger Size & Weight: This is the major disadvantage. DIP packages have a much larger area requirement on the PCB as compared with their SMD packages.
  • Limited Pin Count: Effectively restricted only up to 64 pins, so that it cannot accommodate complex ICs that have I/Os of several hundred.
  • Performance Limitations: Parasitic capacitance and inductance are introduced because of the lengthy signal cables.
  • Challenges of automation: Though this type of assembly can easily be automated using THT inserting machines, the processo di assemblaggio is relatively slower and more costly than the HS SMD assembly process.

DIP Package Alternatives

In response to the growing trend of electronic miniaturization, various new technologies have emerged as alternatives to traditional DIP packages. These technologies offer advantages such as smaller size, increased pin count, enhanced electrical and thermal performance, and higher integration. Leveraging these technologies effectively can help address the requirements of smaller, faster, and more integrated electronic devices. Here are some notable examples:
  • Chip Scale Package (CSP): An ultra-compact package that allows direct mounting of the chip onto the circuit board without the need for separate pins. This enables a significant reduction in size and enhanced integration.
  • Array di sfere a griglia (BGA): BGA employs ball joints to establish robust solder connections between the PCB and the chip. This enables the chip to have a higher density of pins, resulting in improved electrical performance and increased functionality.
  • Quad Flat No-leads (QFN): This package features pins on the bottom surface that connect to the PCB through pads. QFN packages offer a lower profile height, superior heat dissipation performance, and are well-suited for applications with space constraints and gestione termica requirements.
  • Small Outline Integrated Circuit (SOIC): Widely recognized as a common replacement for DIP packages, SOIC packages strike a balance between cost and performance, making them a popular choice in various PCB applications.
  • System-in-Package (SiP): SiP technology integrates multiple components, such as chips, capacitors, and resistors, into a single package, forming a complete functional module. SiP packages are ideal for highly integrated projects requiring seamless coordination among different functionalities.
  • 3D Packaging: This technique involves stacking multiple packaging layers together to enhance space efficiency and integration. By utilizing the vertical dimension, 3D packaging enables higher component density while conserving board space.
 
CaratteristicaDIP (THT)SOP/SOIC (SMD)QFP (SMD)QFN (SMD)BGA (SMD)
Mounting TechnologyThrough-HoleMontaggio a superficieMontaggio a superficieMontaggio a superficieMontaggio a superficie
Pin Pitch2.54 mm1.27 mm & smaller0.8mm, 0.5mm & smallerLeadlessSolder Balls
PCB AreaVery LargeMedioMedium to LargePiccoloVery Small
Profile HeightAltoBassoBassoMolto bassoBasso
Pin Count RangeLow (≤ 64)Low to MediumMedium to HighLow to MediumMolto alto
Prestazioni termicheFairBuonoBuonoEccellenteEccellente
Difficoltà di rielaborazioneEasyModeratoModeratoDifficileVery Difficult
Primary ApplicationPrototyping, High-RelGeneral PurposeMicrocontrollers, ASICsPower Management, RFCPUs, FPGAs, GPUs

Relationship between DIP and THT

DIP packages cannot exist independently of the Through-Hole Technology (THT) process:
 
  1. Component Insertion: The DIP pins are inserted into the holes on the PCB that are pre-drilled. This used to happen with the help of automated machines.
  2. Saldatura a onda: Wave soldering involves passing the board over a wave of molten tin amalgam that flows up into the plated holes on the board side, thus guaranteeing a smooth interface between the board and the various components.
  3. Selective Soldering: On boards containing a mix of SMD and THT circuits, a solder fountain robot can effectively place the THT only after the SMD component reflowing step is finished.

Design Considerations & Soldering Requests for DIP in PCB

PCB Pad & Drill Design:

  • Drill Hole Size: Usually a few mils more than the pin diameter so that the pins can be readily inserted into the holes. On average, the size of the holes should usually be 4-6 mils.
  • PCB Pad diameter: should at least be 1.5 times the diameter of the holes drilled. This will make the annular ring stronger.
  • Pin Spacing: Exactly designed for a grid of 0.1″ (2.54 mm).

Layout & Routing Tips:

  • Ensure proper pin clearance so that there are no cortocircuiti.
  • Use wider Tracce PCB on power pins.
  • Special analog circuits may benefit greatly if shielded with a grounding plane.

Common Soldering Defects:

  • Solder Bridges: Between the soldered connections of nearby pins.
  • Giunto a saldare a freddo: A dull-looking cracked area due to lack of sufficient heat.
  • Insufficient wetting: This occurs when the solder doesn’t wet the pad or pin properly because of contamination.

DIP Socket Selection Guide

DIP sockets play a crucial role in establishing a detachable connection between DIP components and printed circuit boards. They enable effortless insertion and removal of components without the need for soldering, making them highly valuable in applications that require frequent component replacement or testing. Here are some notable types of DIP sockets available:
 

Standard Sockets

These sockets are the most commonly used and come in various sizes and pin configurations to accommodate different DIP package sizes, such as 8, 14, 16, 20, 24, 28, 40, and more. They consist of a plastic body with spring contacts or metal clips that securely hold the DIP leads.

ZIF (Zero Insertion Force) Sockets

Are specifically designed to minimize stress on DIP components during insertion and removal. They feature a lever or actuator that opens and closes the socket’s contacts, allowing components to be effortlessly inserted or removed. ZIF sockets are particularly beneficial when dealing with sensitive or delicate DIP.

Low Profile Sockets

These sockets have a smaller form factor, making them ideal for space-constrained applications. While they maintain the same pin configuration as standard DIP package sockets, their shorter height allows for efficient space utilization on the PCB.

High-Reliability Sockets

Designed to meet the stringent requirements of applications demanding robust electrical connections and long-term reliability, these sockets incorporate enhanced contact materials or designs. They ensure a stable electrical connection, withstand higher insertion and removal cycles, and exhibit superior tolerance to environmental factors.

Anti-Aging Sockets

Also known as burn-in sockets, these sockets are specially designed for the aging test of DIP. They can endure high-temperature environments and provide a reliable electrical connection during the testing process.

Programmable Sockets

Often referred to as “universal” or “configurable” sockets, these sockets are designed to support different pin configurations, facilitating easy programming or reprogramming of DIP components. They find extensive use in development and prototyping environments.
 
The selection criteria of DIP socket type match the pin count and pitch. Consider the socket’s material (high-temperature for wave soldering), profile height, and contact plating (gold for better conductivity and corrosion resistance).

Industry Applications of DIP

  • Legacy systems: Main component of older computers (like the Intel 8088 or the Z80), game systems, and early arcades.
  • Education & DIY: The standard set used with Arduino shields, breadboard projects, and electronics kits.
  • Industrial Control Systems: Most industrial microcontrollers and interface chips remain available with a DIP packaging method due to their ability to offer a reliable lifecycle with ease of maintenance.
  • Current Equipment: Utilizzato in alimentazione units, relay cards, automobiles, and other applications if the IC needs low pin count packaging and the benefits of the THT assembly technology are of particular value.

Why FS Technology Electronic DIP Assembly

Tecnologia FS has been serving the electronic industry for many years and has a wealth of knowledge in DIP processing. As the best turnkey PCB assembly service Abbiamo servito molti progetti nell'industria delle saldatrici, dell'energia e del controllo dell'energia. Il tema comune di questi progetti è che la percentuale di lavorazione DIP su PCBA è relativamente elevata. Se avete esigenze specifiche per i vostri circuiti stampati (PCB), i nostri ingegneri di processo sono a disposizione per discutere in modo approfondito la tecnologia di assemblaggio DIP. Garantiamo consegne puntuali e, soprattutto, il miglior servizio clienti possibile. L'assemblaggio DIP è una parte importante del processo di Assemblaggio di PCB and determines the quality of the PCBA processing. Next, let us show you our capabilities:

DIP Assembly Line Scale

  • Full facilities from through-hole fabrication to DIP PCB assembly;
  • Completo approvvigionamento di componenti per circuiti stampati compreso Componenti SMD, DIP components, integrated circuits, etc.
  • 7 fully automatic DIP PCBA lines (including plug-ins, repairs, hand soldering wires and lead-free solder pots, etc.) that can mass produce 25,000 pieces of DIP ordinary products per month (minimum);
  • In addition to controllo qualità, FS Technology also pays attention to staff training, and currently has 300+ professional production staff;
  • Coexistence of manual assembly and automatic assembly;
  • Pacchetto ceramico a doppia linea (CERDIP o CDIP)
  • Pacchetto in plastica a doppia linea (PDIP)
  • Pacchetto doppio in linea in plastica termoretraibile (SPDIP)
  • Pacchetto Kinny a doppia linea (SDIP o SPDIP)
  • And More

Garanzia di qualità

  • Controllare rigorosamente il tasso di passaggio DIP;
  • Lavoratori con una formazione rigorosa, per controllare produttività e qualità;
  • Standard di campionamento IPQC e QA LOT rigorosi per garantire l'affidabilità dei dati. DIP processing;
  • Before the plug-in, checks are done on the surface cleanliness of componenti elettronici to detect oil stains, paint and other problems;
  • Durante l'inserimento, è necessario assicurarsi che i componenti elettronici siano chiusi sul PCB per evitare dislivelli e per scoprire bene le piazzole di saldatura;
  • Se c'è un'indicazione diretta sulla superficie dei componenti elettronici, assicuriamoci che sia inserita nella direzione corretta;
  • Si deve prestare attenzione alla potenza dei componenti a innesto e del circuito stampato per evitare danni dovuti a una potenza eccessiva;
  • I componenti elettronici non superano il bordo della scheda/cornice del PCB e prestiamo attenzione all'altezza e alla distanza tra i componenti elettronici.
  • Multiple Test sui PCB guarantee services: manual testing, AOI testing, Test a raggi X, aging testing, test della sonda volante, ecc.

Conclusione

Dual inline packaging has a rich legacy in the PCBA industry and continues to be utilized today. Despite the manual-intensive nature of DIP insertion, which demands substantial labor and may result in higher failure rates due to fatigue and other factors, the electronics processing industry still heavily relies on DIP technology. Presently, SMD adoption accounts for approximately 70% of the market. However, achieving automatic insertion for projects involving large-scale components, such as schede di controllo industriale, remains challenging. Consequently, DIP processing technology is continuously advancing, with notable developments in automated DIP assembly equipment enabling mass production, as exemplified by companies like Tecnologia FS.

FAQs about DIP Package

Not at all. While it’s no longer the first choice for mass-produced, miniaturized elettronica di consumo, it remains highly relevant and widely used for prototyping, education, and in industries that value reliability and ease of maintenance over small size.
While 64-pin DIPs exist, they are rare and mechanically unwieldy. The practical upper limit is around 40 pins. For higher pin counts, SMD packages like QFP or BGA are necessary.
Absolutely. DIP packages are one of the easiest IC packages to hand-solder using a soldering iron, and they are equally easy to desolder with a solder sucker. This is a key reason for their enduring popularity.
The primary difference is the mounting technology. DIP is a through-hole package, while SOP (Small Outline Package) is its surface-mount counterpart. SOP is much smaller and has a lower profile but is harder to hand-solder and lacks the mechanical strength of a through-hole connection.
The window is made of transparent quartz and allows UV light to pass through to erase the data on an EPROM (Erasable Programmable Read-Only Memory) chip, making it reusable.

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