How to Use Solder Paste in PCB Assembly
A crucial component in electronic devices is the PCBA board, consisting of two main parts: PCB and Components. The PCB supports and connects the components, which, in turn, provide the actual functionality. Initially, these two parts are separate, but through the assembly and soldering process, they are eventually combined into a unified whole.
In this assembly process, the use of certain key materials is necessary, and one of these is solder paste. This article will provide a detailed overview of the role of solder paste and a guide on how to correctly use solder paste in the Processus d'assemblage des PCB.
What is Solder Paste and Its Purpose
One of the most reliable methods to connect two metals without melting them is soldering, and solder paste is essential for achieving this. Solder paste is a special metal alloy composed of metal solder particles and a unique combination of flux. During the soldering process, the distinctive properties of solder paste allow it to melt and form a permanent bond, thus establishing a reliable connection between metals.
To ensure good performance during the soldering process, solder paste must meet several important standards. Firstly, it must have a relatively low melting point, considering the sensitivity of components to temperature. If the melting point of the solder paste is too high, there is a risk of reaching the maximum temperature the components can withstand before it fully melts. Secondly, the conductivity of solder paste is crucial as it is used not only for mechanical connections but also as an electrical connection, ensuring uninterrupted flow of electrical current to the components. Lastly, to ensure safety for both humans and the environment, the raw materials of solder paste must comply with the strict requirements of the Directive RoHS.
In the past, approximately 40% of solder pastes in electronic manufacturing consisted of a combination of lead and tin. However, due to the environmental hazards associated with lead, and with advancements in technology and increased environmental awareness, the electronic manufacturing industry has gradually transitioned to lead-free processes. Consequently, lead-free solder paste has become the mainstream choice, reflecting a positive response to environmental concerns and industry focus on health and sustainability.
Choosing the Right Solder Paste Type
Using high-quality and the correct type of solder paste is a crucial step in ensuring the quality of PCBA boards. In assembly projects, FS Technology offers various grades and types of solder pastes to meet different requirements. You can choose based on the materials planned for soldering and the needs, or select according to the size of solder balls in the solder paste.
To meet the requirements of different projects, solder pastes are usually divided into different grades and categories. These grades are not solely based on the accurate size of solder balls but are evaluated based on around 80% of the solder balls falling within a specific size range. Here are the various grades and their corresponding solder ball sizes.
Qualité de la pâte à braser | Taille de la particule |
Type 1 | 75mm à 150mm |
Type 2 | 45mm à 75mm |
Type 3 | 25mm à 45mm |
Type 4 | 20mm à 38mm |
Type 5 | 10mm à 25mm |
Type 6 | 5mm à 15mm |
Type 7 | 2mm à 11mm |
Type 8 | 2mm à 8mm |
In addition to considering the particle size, choosing the appropriate solder paste based on the type of flux is also a viable option. Different types of Flux de PCB can better match specific solder paste formulations to achieve better soldering results or meet specific process requirements. However, not all environments allow for the use of this type of flux, and it must be ensured that the environment is clean enough.
- Water-Soluble Flux Paste: Composed of organic components and ethylene glycol base. Residues of water-soluble flux can be easily removed by using readily available cleaning products on the market.
- No-Clean Solder Paste: This type of solder paste is typically used in the manufacture of no-clean flux. It has relatively low solid residues and resin content. The main advantage of using a no-clean flux is the potential cost savings on cleaning supplies.
- Rosin-Based Solder Paste: Solder pastes of this kind are made from rosin and can be cleaned using solvents after soldering.
Storing PCB Solder Paste
Depending on the temperature and humidity of the Usine de PCBA, store these ready-to-use solder pastes in specially designed packaging that keeps the product’s temperature between 0° and 30 °C (86 °F and 84 °F) for at least 48 hours.
La pâte à braser doit être livrée de nuit ou par transport réfrigéré. En été, transportez-la de nuit autant que possible pour réduire le temps et éviter les températures élevées. L'emballage de la pâte peut inclure des packs de froid qui arrivent fondus. Si le temps de transport de 48 heures n'est pas dépassé, cela est typique et n'est pas un signe de dommage ou de mauvaise manipulation. À l'arrivée, la pâte à braser doit être déplacée immédiatement vers un stockage contrôlé. L'utilisation de la réfrigération est conseillée mais pas toujours nécessaire.
À des températures normales (22 °C/72 °F), les pâtes à souder ont généralement une durée de conservation comprise entre trois et six mois. Non réfrigérée : 25 °C (77 °F) / Réfrigérée : 0°-12 °C (32 °F-55 °F). Les performances de la pâte à braser peuvent être affectées par une exposition à des températures supérieures à 30 °C (85 °F). Conservez la pâte à braser à l'écart des sources de chaleur supérieures à 32 °C (90 °F). Dans la mesure du possible, stockez les pâtes à braser dans des seringues ou des cartouches verticalement, pointe en bas. Les paquets doivent occasionnellement être tournés de 180 degrés s'ils sont stockés horizontalement.
La pâte doit être utilisée avant la date indiquée sur le TDS spécifique au produit, qui correspond à la date de fabrication (DOM) figurant sur l'étiquette. Dans le cadre d'un système FIFO avec enregistrement de la date et de l'heure de retrait du stockage, les lots de pâte à souder les plus anciens doivent être utilisés en premier. L'utilisation à froid de la pâte à braser n'est pas autorisée. Avant d'ouvrir l'emballage de la pâte, il faut laisser le matériau de remplissage atteindre la température ambiante, qui est de 20°-25 °C (68°-77 °F). Normalement, cela prend entre quatre et six heures. NE PAS CHAUFFER LA PÂTE AVEC FORCE.
La pâte à souder en pot doit être légèrement et soigneusement mélangée avec un outil en plastique pendant au moins une minute après avoir atteint la température ambiante. Les seringues et les cartouches de pâte à braser n'ont pas besoin d'être mélangées. Il n'est pas conseillé d'utiliser un équipement automatisé pour mélanger la pâte à braser, car cela pourrait endommager la pâte à braser.
PCB Solder Paste Printing Process
Stencil Printing
The most common practice is stencil printing, which is a special metal grid structure typically made of stainless steel. Manufacturers first create a Pochoir pour circuits imprimés with holes or apertures of the same size and shape as the surface mount pads in the design. To ensure accuracy, FS Technology employs laser cutting technology to process the stencil and applies a coating material on the surface to smooth the apertures and facilitate even distribution of solder paste.
The stencil is then placed in an SMT device and aligned with the PCB below. Solder paste is uniformly applied to the stencil, and a squeegee blade is used to scrape off excess paste, allowing it to drop onto the PCB surface through the apertures. The entire process typically takes about 15 to 45 seconds.
After the solder paste printing is completed, SPI testing is conducted to assess the uniformity and quality of the solder paste, ensuring each pad receives the correct coverage. Finally, the stencil is cleaned after completing a batch of PCB solder paste printing to ensure that residue from the previous printing does not impact the distribution of solder paste on the next board.
Impression par jet
While stencil printing is advantageous for assemblage de PCB à grande échelle, constructing the stencil takes a considerable amount of time and precise control over the solder paste quantity for each component is challenging. Therefore, Jet Printing is becoming increasingly popular.
Jet Printing utilizes a modified formula to create a more liquid-like solder paste. Inkjet printers, using the same PCB design data as stencil printing, apply a precise amount of solder paste to each interface pad on the board. Depending on the solder material required for the application, the printer can easily switch and alternate between solder paste cartridges, from which tiny droplets of solder paste are jetted out.
Jet Printing technology allows PCB assemblers to precisely control the amount of solder paste for each interface, providing them with significant flexibility. This means that solder paste quantities for each solder point can be adjusted based on specific requirements.
Manual
In repair or hobbyist projects, the printing method is usually not employed to apply solder paste to PCBs. Instead, there are two common manual methods:
- Using a syringe, precisely apply solder paste to the pins and then use a soldering iron to bond it with the pins.
- Place solder wire between the two pins of the component and then use a soldering iron to heat it.
Regardless of the method chosen, the ultimate goal is to establish a reliable connection between the PCB and the component. After manual soldering is completed, it is advisable to perform a quality check and conduct functional tests to ensure the reliability of the connections.
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