PCB multicouches fabricant chinois
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PCB multicouche

Circuits multicouches - le premier choix pour l'électronique de pointe

Le développement de la microélectronique est comme un torrent inarrêtable, et les cartes de circuits imprimés multicouches complexes sont également devenues un composant en vogue. Se distinguant des circuits imprimés standard, les two-layer PCB, a multilayer PCB is made up of more layers that are laminated together and insulated by a greater series of prepreg and copper that are stacked on top of each other. Generally, we call a circuit board with more than 4 circuit layers a multilayer PCB (MLB PCB), which means that designers can design more circuits inside the PCB. With a multi-layer PCB, there is a repeated pattern of prepreg and core (substrate) material in between the outermost top & bottom layers, offering several advantages to both through-hole and surface mount designs. Usually, a 4-layer circuit structure can give the PCB good electrical performance and is suitable for most electronic products, but we are still happy to increase its number of layers to obtain higher pressure-bearing capacity.

Get a Multilayer PCB Quote from FS Technology

FS Technology is a one-stop PCBA manufacturer, providing Fabrication de PCB et Services d'assemblage de PCB that meet the needs of a large number of engineers. Partnering with FS Technology will get you great value and a fun trip. We produce multi-layer circuit boards from 1-58L for our customers in a simpler step: structuring, lamination, and through-hole plating. Most of the time, various unexpected things will happen with the increase in the number of board layers, but we can avoid the risks that customers need to face through strict quality control and commitment. The following is the multi-layer PCB sample produced by FS Technology:

High-quality Multilayer PCB Supplier

Quality is the foundation of FS Technology, and it is also the hard cornerstone of development. As a Entreprise de PCBA clé en main that prioritizes quality, we control the quality of PCB from the source. If the quality of the raw material used in the project cannot be guaranteed, the produced circuit board may have various issues, such as blistering, delamination, cracking, board warpage, and uneven thickness. So, the quality of raw material is the premise to ensure the production of high-quality multilayer PCB, and strict contrôle à l'entrée is the first step of service. We maintain a zero-tolerance attitude towards product defect issues. Once a problem is found, it will immediately register a report and develop a solution.

L'expérience de fabrication passée a montré que la qualité des différents types de cartes multicouches varie considérablement. Par exemple, circuit imprimé multicouche en céramique, metal core multilayer PCB, HDI multilayer PCB are much more difficult and risky to manufacture than ordinary multilayer boards. In order to ensure the quality of production and avoid errors in the subsequent assembly process, we need to ensure the quality of the product produced. Professionals can easily judge the quality of the printed circuit board after receiving the product, but this will undoubtedly slow down the progress of the entire project. FS Technology is here to show you our quality control standards through advanced manufacturing methods and strict testing.

Un processus de fabrication parfait

Le processus de fabrication d'un PCB multicouche est approximativement le suivant :

  • Créer une image intérieure
  • Gravure de la couche interne
  • Empilage de PCB multicouches
  • Trous traversants et trous de montage
  • Gravure de la couche extérieure
  • Trou de passage plaqué
  • Ajouter le masque de soudure
  • Draw the Couche de sérigraphie
 

To start with, the base of a standard two-layer PCB is the substrate material (core), which is oftentimes fiberglass epoxy resin. The next layer is the copper which is laminated onto both sides of the substrate to establish electrical conductivity and finally, the masque de soudure is laminated onto both sides of the copper to protect the copper layer against oxidation and to help make soldering easier. If we take a Panneau multicouche à 4 couches par exemple, il est fabriqué en combinant essentiellement deux cartes PCB standard à deux couches, souvent par laminage à haute température et sous pression (compression) avec une presse hydraulique. Bien sûr, il y aura plusieurs couches de préimprégné, de cuivre et de matériau de base qui seront empilées les unes sur les autres entre les deux couches les plus extérieures (constituant les couches multiples), qui seront ensuite comprimées ensemble pour former un PCB multicouche. 

FS Technology’s Processus de fabrication des PCB est aujourd'hui réalisée par des machines de haute technologie qui, grâce à l'utilisation de logiciels, peuvent être réalisées sans effort et avec une imprécision proche de zéro, ce qui les rend aptes à la production de masse.

Test de PCB multicouches

Nous fournissons une variété de Services de test des PCBy compris, mais sans s'y limiter, les éléments suivants :

 

Le test des circuits imprimés est une partie importante du processus de production, qu'il s'agisse d'un PCB ou d'un PCBA, en particulier pour un PCB multicouche avec une structure de circuit plus complexe. Le nombre de couches du circuit imprimé est réalisé par la technologie d'empilage. Lorsque le nombre de ces couches augmente, le fabricant est confronté à des risques de fabrication plus importants. Pour cette raison, le processus de test du circuit imprimé multicouche doit être prise en compte.

Dans l'atelier de production de FS Technology, chaque processus de production est équipé d'un poste spécial d'inspection de la qualité pour s'assurer que chaque processus a la mise en œuvre de procédures opérationnelles, afin de faciliter le contrôle global de la qualité des PCB. FS Technology promet que, quelle que soit la rigueur du processus de test auquel ces cartes ont été soumises pendant la production, nous appliquerons strictement les normes d'échantillonnage fournies par les clients une fois la production terminée. Si le taux de qualification de l'inspection d'échantillonnage du produit est conforme à la norme, il sera approuvé pour quitter l'usine, sinon, une inspection et un entretien complets seront effectués.

Service Area

Printed circuit board are an essential hardware component of almost all electronic & electrical devices, as it allows for a complete (closed) circuit to be made between electronic components. Predominantly with the use of conductive copper tracks & traces on a PCB, an electrical connection can then be made from one point to another. Typically, you will find that many PCB are two-layer boards, meaning that there is an inner core layer (substrate) in the center of the board that is sandwiched between first a solder mask on the outermost layer (giving it its color) and a copper coating on the subsequent bottom layer, giving the traces its conductive properties. However, you have to use high-precision multilayer PCBs for complex applications.

In the past operations, FS Technology’s customers are located in more than 70 countries around the world, and their fields are also different. The same thing is that they rely on our strong manufacturing capabilities to gain advantages in their respective fields. Here are some of the industries we have served:

PCB multicouche flexible pour ordinateur
Dispositif informatique
Fabrication de circuits imprimés multicouches pour connecteurs électroniques
Connecteur électronique
Fabrication de circuits imprimés multicouches pour smartwatch pour enfants
Montre intelligente pour enfants
Circuit imprimé flexible multicouche pour Smart TV
Télévision intelligente
Électronique militaire circuit imprimé flexible multicouche
Électronique militaire
circuits imprimés multicouches en céramique pour l'électronique aérospatiale
Électronique aérospatiale
Communication Électronique circuit imprimé multicouche rigide
Électronique de communication
fabrication de circuits imprimés multicouches pour systèmes satellites
système satellitaire

Top-notch Manufacturing Capabilities

CaractéristiquesStandard

Manufacturable Layers

  • Multilayer Rigid PCB: Pour PCB rigide we can build 1–58 layers of circuits, and provide a variety of additional value-added services.
  • Multilayer flexible PCB: It is generally considered that its manufacturing difficulty is higher, most manufacturers can achieve within 6 couches, and in FS Technology you can get amazing 10 layers of PCB flexible!
  • Multilayer Rigid Flex PCB: It is necessary to combine the rigid board and the flexible board, and the number of layers of the rigid-flexible PCB depends on the flexible circuit.

Substrate Type

Finitions de surface

Rich Test des PCB

  • Test de la sonde volante
  • Test de fonctionnement
  • Test d'impédance
  • Test de soudabilité
  • Test électrique
  • Essai de choc thermique
  • Test de résistance aux trous
  • Inspection optique automatique
  • Vérification manquante du tampon

Necessity of Multilayer PCB

The number of layers of the circuit board is an important factor that leads to rising costs. For this reason, the necessity of considering multi-layer PCB needs to be considered before the project begins!

Electronic Development Status

The core of Moore’s Law states that the number of transistors that can be accommodated on an circuit intégré doubles every 18 months. As the packaging density of integrated circuits increases year by year, the demand for electronic products develops in the direction of multi-functionality and miniaturization, necessitating the use of multi-layer boards. In the layout of printed circuit boards, unforeseen design problems such as noise, stray capacitance, and crosstalk may arise. As a result, minimizing the length of signal lines and avoiding parallel routes has become a challenging task in circuit board design.

Unfortunately, whether it is a single or double-layer board, designers face limitations in achieving a satisfactory solution due to the restriction on the number of crossovers that can be achieved. The manufacturing of multilayer circuit boards has become imperative in an environment of extensive interconnection and crossover requirements. The original intention of multilayer PCB fabrication is to provide more freedom for the circuit layout of complex electronic products. Therefore, it is essential to consider whether your electronic project truly requires more layers of PCB, and this can be determined by examining its advantages and disadvantages.

Avantages des PCB multicouches

Petite taille

The smaller size of MLB is attributed to two factors: reduced surface area and assembly techniques.

Increasing board surface area by adding layers: It is evident that large-sized PCBA boards cannot fit into electronic equipment easily. Just like an unfolded quilt being difficult to place inside a box, large boards are impractical. The principle of multilayer PCB board is to obtain more wiring within the same size by increasing the number of layers, akin to folding the quilt to fit it into the box.

Assembling ML-PCBA using SMT technology: High precision multilayer PCB is extensively used in cutting-edge applications, often in conjunction with Montage SMT. Traditional plug-in components struggle to meet the demands of micro/nano consumer devices and are replaced by Composants SMD. Consequently, assembly can be completed on smaller-sized PCB.

Haute densité

The most common application demonstrating the high-density benefits of multilayer circuit board is mobile phones. With the iterative update of the production process, the size of the mobile phone is getting smaller and smaller, but the function has not been affected but improved, thanks to the high-density interconnected (HID PCB) MLB used in its design. When we increase the number of layers of the PCB, although its size remains the same at this time, the multilayer HDI PCB increases the wiring density through layering, enabling it to accommodate more functions, speed, and capacity.

Plus léger

A multilayer board can replace the need for multiple PCB, providing greater durability as it eliminates the requirement for external hardware and connectors. The removal of connectors also reduces the weight of electronics, making them suitable for small appliances. Additionally, this reduction in hardware and connectors may lead to lower maintenance and replacement needs in the long run.

In general, the most significant advantage of multilayer circuit boards is their small form factor, lightweight design, and increased capabilities for handling more complex electrical routing. In this era of electronics, simplicity is crucial, and eliminating unnecessary parts in a project can be favorable in terms of cost and troubleshooting. Large-scale industrial production faces challenges in producing and manufacturing numerous designs and enhancing production efficiency. Multilayer PCB can fill this gap and provide a compact yet reliable solution for improving aspects of PCBA construction and production.

Inconvénients des PCB multicouches

Difficulté de conception

Même si les circuits imprimés multicouches présentent de nombreux avantages séduisants pour un amateur d'électronique ou même un concepteur passionné, il y a certainement quelques complexités de la conception que vous devez garder à l'esprit lorsque vous envisagez un circuit imprimé multicouche.

Dès le début du processus de conception, la conception d'un PCB multicouche implique une courbe d'apprentissage par rapport à un PCB ordinaire que vous avez peut-être fabriqué dans le passé, car elle implique un routage et des caractéristiques de conception plus complexes à prendre en compte. Les couches qui composent un PCB multicouche sont énumérées ci-dessous :

  • Couche de signal : principalement utilisée pour placer les composants PCBA ou pour le câblage et la soudure. Elle est divisée en trois couches : la couche supérieure, la couche intermédiaire et la couche inférieure.
  • Alimentation électrique interne : Généralement, nous l'appelons aussi la couche électrique interne, qui est spécialement utilisée pour disposer les lignes électriques et les lignes de terre.
  • Couche mécanique : Placez les lignes de dimension physique, les données, les informations sur les via et autres informations indicatives pour la fabrication des cartes PCBA.
  • Masque de soudure : Une zone sans cuivre utilisée pour placer des pastilles ou d'autres objets, y compris les couches supérieures et inférieures.
  • Couche de sérigraphie : utilisée pour marquer le contour, le numéro et d'autres informations textuelles des composants.
  • System Work Layer: Used to display information that violates the multi-layer Conception de circuits imprimés rule check.

Difficultés de fabrication

  • Alignment between layers: With more layers, the difficulty of achieving precise alignment between them increases, and the alignment tolerance between layers is typically controlled at ±75μm. This challenge arises due to various factors, including size variations, matériau du substrat properties, ambient temperature differences, and positioning methods.
  • Inner layer manufacturing: When customers seek a multilayer PCB manufacturer, they often assess the materials the manufacturer can provide. These materials are usually required to have high thermal resistance (TG), high-speed characteristics, high-frequency capabilities, thick copper, and thin dielectric layers. Working with higher-end materials can pose challenges for manufacturers during inner layer circuit production and graphic size control, leading to issues such as low pass rates, open circuits or short circuits, missing tests in inner layer AOI (automated optical inspection), and poor exposure.
  • Lamination : During lamination, when multiple inner core boards and semi-cured sheets are stacked, manufacturing defects like slippage, delamination, resin voids, and air bubble residue may occur. To prevent such problems, it is crucial to consider the heat resistance and voltage resistance of the materials and establish a reasonable multi-layer PCB lamination program.

Livraison et coût

Des erreurs sont susceptibles de se produire si vos cartes ne sont pas vérifiées correctement et de nombreux concepteurs travaillent généralement en équipe pour vérifier leurs conceptions avant de les envoyer à la production, car la résolution des problèmes peut prendre beaucoup de temps et être très coûteuse. En outre, les circuits imprimés multicouches sont généralement plus coûteux lorsqu'il s'agit de fabriquer et de commander des circuits professionnels et leur fabrication prend plus de temps que celle d'un circuit imprimé ordinaire à deux couches. 

Cela peut être dû aux contrôles et tests fonctionnels approfondis qui doivent être effectués sur les cartes avant qu'elles ne soient prêtes à être produites, car il n'est tout simplement pas possible de corriger les erreurs après la production. Il est donc conseillé, avant de commander un circuit imprimé multicouche, de procéder à une vérification approfondie du fabricant afin de s'assurer que les exigences fixées par l'entreprise correspondent à celles de votre commande.

Multilayer Circuit FAQ

Of course, FS Technology is a Chinese multi-layer PCB supplier facing the world, no matter where you are, we will provide you with the best quality service.

We are not a company that attracts clients on price, but on quality of service. If you want to get our service, please contact us by email, we will provide you with multilayer PCB pricelist immediately.

As the number of layers increases, the failure rate also rises. To prevent such issues, in addition to routine inspections, we employ various internal control measures to enhance production quality. These include Inspection du premier article, manufacturing process control, and continuous monitoring and improvement.

For most circuit types, FS technology can realize the construction of multi-layer structure, but it may be difficult for PCB en céramique. If your project requires the use of ceramic slabs and requires multiple layers then we will build it for you using Rogers Corporation laminates.

First, engineers stack each single-layer or double-layer PCB according to the design requirements. Then, the stacked PCB is placed in a hot press for compression. Under high temperature and pressure, the pre-impregnated resin in the laminated material melts and bonds with the copper foils and hole walls of each layer, creating a strong connection.

When faced with complex designs or high-density layouts, FS Technology recommends using a multi-layer circuit structure, which can help avoid electromagnetic interference and implement effective thermal management.

Résumez

As mentioned briefly above, multilayer board is widely used in many PCB pour l'électronique grand public, ranging from mobile phones to graphic cards, and even state-of-the-art medical equipment. The compactness, reliability, and durability of multilayer PCBs make them highly suitable for these applications, particularly in industrial settings where versatility, consistency, and high performance are crucial. Additionally, multilayer PCB find applications in aerospace technology, navigation equipment (GPS), communications (radios), automotive machinery, and military-grade equipment. However, the use of multilayer PCB in industrial applications does not imply that they should not be considered for other electronic projects. Before choosing the route of multilayer PCBA, it is essential to weigh the pros and cons and be well-informed about both your design and the manufacturer of your PCBA. Nevertheless, single or double-layer PCB still have their place in the electronics industry and may be ideal for various applications that do not require the complexity of multilayer PCB.