DIP Components-A circuit board part for assembling PCBA

DIP stands for Dual-In-Line Package. It is one of the most used through-hole technology IC packaging methods. In other terms, it can be abbreviated as DIL. This type of packaging is met-molded from epoxy resin that is opaque which a lead frame attached to offer support to the chip and act as connecting pins that extends out in a vertical direction from the rectangular house made up of plastic. It is optional to plate the parallel metal pins with gold, silver, or tin but for a neat appearance, the pins on both sides of the IC should be plated.

DIP components are either mounted on the board or inserted into the circuit socket by the use of drilled-through holes. It is prudent to note that DIP is also referred to as DIPn where n represents the total number of pins present in the component. For instance, a THT IC package that has two rows of 10 pins would be labeled DIP20. It is common for you to come across packages ranging between 4 and 64 pins. Sometimes pins go up to 100. 

The pins number is what determines the size of the DIP component. We have a pin count of all even numbers from four to twenty, then 28, and 40 which forms the most common pinned DIPs available. Pins attached to the DIP components are made up of different sizes of pitches. Such pitches include 0.5, 0.65, 1.27, and 2.54 with the units in mm. The pitches are designed such that it is possible to mount the components on the breadboards, prototype boards, and Vero boards. It is prudent to mention that there exist several special cases where special DIP pitches are required.

Introduction of DIP components

Types of DIP components

There exist many types of DIP component used in IC packaging and they can be divided into the following main types:

  • Plastic DIP
  • Skinny DIP
  • Ceramic Sealed type DIP
  • Shrink Plastic DIP
  • Singe-layer Ceramic DIP
  • Multilayer Ceramic DIP
  • Side Brazed Ceramic DIP
  • Metal or Hybrid DIP
 
Plastic DIP component is the most available. It has a plastic rectangular housing and it is created by fusing and gluing the plastic casing around the designed leads. Plastic being porous, the product cannot be hermetic. Thermosetting resin is the most used material since it has an ultra-short curing process that can the low fabrication of hundreds of chips within a very short period. The use of plastic or ceramic is motivated by their high availability and hence reliability. The ceramic material offers momentous air tightness as compared to the plastic one.

Features of DIP components

Below are the features of DIP components:

  • Spacing

The internationally accepted spacing of the DIP package is 2.54mm between the two pins. This is the standard used by JEDEC. Some European countries use 2.5mm. the distance separating the rows of pins is dependable on the number of pins.

  • Needles numbers

The number of pins connected to any DIP component should be an even number. Some of the common DIP pins are 8, 10, 14, 18, 24, 32, and 40. The maximum number of pins connected in the modern DIP component is 64.

  • PINs numbers and Orientations

With the identification tag of the DIP part facing up, then the first pin located on the upper left is labeled as pin 1 and the rest of the pins are sorted in the anticlockwise system. When you jump to the other raw, the pins are labeled from the bottom end to the top.

  • DIP Components Application

Previously, many digital IC used this type of technology. From VGAs to SVGA cards and BIOS, you will come across DIPs. In the modern assembly of electronic devices, DIPs are commonly used in parts such as resistors, diodes, transistors, and LEDs.

Other common uses are:

  • DIP switch
  • Computer
  • Relay
  • Bar display
  • Seven-segment display

Process Technology of DIP Component Assembly

Due to the rapid injection of SMD components into the market, there is a higher tendency that the technology will replace DIP parts. But this has not been achieved due to the excessively large sizes of some of the electronic components produced during PCBA production and which can only be produced by the use of the DIP plug-in process.  The use of machines in production plays a very significant role. The DIP plugin process comes in after the SMT patch process and it is not necessary to replace it with a manual method that is more labor-demanding and time taking.

Let us discuss the steps used in the technological process that is employed in DIP assembly processing:

  • Step 1: Pre-processing Components

This is the first step taken by the pre-processing workshop workers. They collect all the necessary materials according to the designer’s BOM. They have to carefully check material specifications, model and sign then preprocess as per the model before carrying out production using an automatic belt molding machine, a transistor automatic machine, a capacitor shearing machine, and other available molding equipment.

  • Step 2: Plugins

Here, the processed SMD component is inserted into the corresponding required position on the printed circuit board in readiness for soldering through the wave soldering technique.

  • Step 3: Wave Soldering

The plugin printed circuit board is systematically placed on the production line conveyor belt that leads to the wave soldering and the soldering occurs after spraying the PCB flux, preheating, followed by wave soldering, and finally cooling.

  • Step 4: Component Cutting

The feet of the soldered PCBA are cut into appropriate sizes as per the design.

  • Step 5: Repair Welding

Some of the boards might be found to be unwelded and hence you need to repair and carry out maintenance to ensure that they are in the expected condition

  • Step 6: Wash the Board

This is the process that is used to remove the harmful substances after finishing processing the PCBA to ensure they are clean and safe from environmental hazards. The cleaning helps in removing excessive flux and other debris like oils and dust.

  • Step 7: Functional Test

After welding the components, the finished product should undergo functional testing to see if the function intended has been achieved. If defects are present repairing and retesting should be undertaken until the correct functionality is achieved.

Precautions for installing DIP components:

The process starts with the drilling of holes in the exact reserved positions and the number labeled on the through-hole must correspond to the number that is labeled on the pins. The component pins are fixed on the drilled holes and then soldered. The operation is quite simple but enough care should be taken to protect the component pin against damage. In addition to the use of holes in mounting, DIP mounting sockets are available. Sockets are very good, especially during the prototyping process where removal of the IC is frequent. The socket can help you overcome overheating challenges that are present during wave soldering.

Summarize

FS Technology’s introduction to this kind of electronic circuit board components used to assemble PCBA boards has basically ended, and then we will sort out and summarize the content of the above articles.

  • DIP stands for Dual-In Line package is the most common type of through-hole technology used;
  • DIP is achieved through several steps which include pre-processing components, plugins, wave soldering, component cutting, repair welding, washing the board, and functional test;
  • several types of DIP components category exist which include: PDIP, SDIP, CSDIP, SPDIP, SCDIP, MCDIP, SBCDIP, and MDIP;
  • DIP installation can be done directly by drilling a hole in the board and inserting the component before wave soldering or by use of the DIP socket;
  • DIP features include spacing, needle numbering, and pin numbering and orientation;
  • DIP applications include DIP switches, relays, computer seven-segment displays, and BAR displays.

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