Electronic DIP Assembly Overview
It is common knowledge that producing high-quality printed circuit boards (PCBs) is a labor-intensive process that calls for extensive inspection, testing, mounting, and soldering. As a result, we provide full DIP assembly as one of our services. This is meant to cut costs, improve accuracy and productivity, and make the whole process of assembling and checking PCBs from start to finish easier and faster.
A dual in-line package, also known as a DIL package, THT assembly or through-hole assembly, is a kind of electronic device package that consists of a rectangular enclosure and two parallel rows of electrical connection pins. This type of PCB-Montage refers to a process of mass-producing solder connections in which a printed circuit board (PCB) with components already installed is immersed in a tin furnace. All of the pins are parallel, point down, and stick out past the bottom plane of the package at least far enough to be through-hole mounted to a printed circuit board (PCB), which means they can go through holes on the PCB and be soldered on the other side. The term “DIP” refers to a device packed as a plug-in, and the number of pins on this kind of device often does not exceed 100. Soldering dip-packed components after surface mount technology (SMT) is a process that is often referred to as “DIP welding” or “DIP post welding.”
Most small and medium-sized integrated circuits also use this type of packaging. Most of the time, there are only 100 pins. A DIP-packaged CPU chip has two rows of pins that need to be inserted into a DIP-structured chip socket. It can, of course, also be plugged straight into a circuit board with the same number and arrangement of soldering holes. When plugging and unplugging a chip from a DIP packaging technology, one should take care not to damage the pins.
Why FS Tech is reliable for DIP assembly?
FS technology has been serving the electronic industry for many years and has a wealth of knowledge in DIP processing. As the best turnkey DIP PCB assembly service company in China, we have served many projects in the welding machine and energy industry as well as the power control industry. The common of these projects is the proportion of DIP processing on PCBA is relatively large. If you have specific demands for your printed circuit boards (PCBs), our process engineers are available to discuss DIP assembly technology in-depth. We guarantee on-time deliveries and, most importantly, the best possible customer service. DIP plug-in is an important part in the PCB Montageprozess. Basically, the quality of the DIP plug-in determines the quality of the PCBA processing. Next let us show you our capabilities:
DIP Assembly Scale
- 7 fully automatic production lines can mass produce 25000pcs DIP ordinary products per month (Min);
- In addition to quality control, FS Technology also pays attention to staff training, and currently has 300+ professional production staff;
- Coexistence of manual through-hole assembly and automatic DIP assembly;
- Keramisches Dual In-line Gehäuse (CERDIP oder CDIP)
- Kunststoff-Dual-Inline-Gehäuse (PDIP)
- Shrink Plastic Dual In-line Gehäuse (SPDIP)
- kinny Dual In-line Gehäuse (SDIP oder SPDIP)
- Kontrollieren Sie die DIP-Pass-Through-Rate strikt;
- Streng geschulte Mitarbeiter, um Produktivität und Qualität zu kontrollieren;
- Strenge IPQC- und QA LOT-Stichprobenstandards, um die Zuverlässigkeit der DIP-Verarbeitung zu gewährleisten;
- Prüfen Sie vor dem Einstecken die Sauberkeit der Oberfläche der elektronischen Komponenten, ob Ölflecken, Farbe und andere Probleme vorhanden sind;
- Achten Sie beim Einstecken darauf, dass die elektronischen Bauteile auf der Platine geschlossen sind. Vermeiden Sie Unebenheiten und decken Sie die Lötpunkte gut ab;
- Wenn auf der Oberfläche elektronischer Komponenten eine Richtungsangabe zu finden ist, vergewissern Sie sich, dass der Stecker in der richtigen Richtung eingesteckt ist;
- Achten Sie auf die Stromstärke der eingesteckten Komponenten und der Leiterplatte, um Schäden durch zu hohe Stromstärken zu vermeiden;
- Elektronische Bauteile dürfen nicht über den Rand der Leiterplatte/des Rahmens hinausragen, und achten Sie auf die Höhe und den Abstand zwischen elektronischen Bauteilen.
How does FS Tech perform DIP PCB assembly service?
We first check and write down the quantity, item number, size, component silkscreen number, value, etc., of all the parts you send us.
Some component outlines need to be done ahead of time because of how they are made or because of the requirements for PCB DIP soldering and the whole PCB plan.
In this step, we place the material for the plug into the pins and then insert the pins into the PCB board. During plugging-in, it is essential to pay attention to the strength of the plug-in to prevent any damage to the circuit board or the nearby components. At the same time, make sure that the Orientierung der PCB-Komponenten, component position, and component height are all consistent with one another.
Now, wave soldering is used for soldering the board that has been introduced. In wave soldering, flux is applied to a printed circuit board (PCB) during an in-line procedure. The printed circuit board is then preheated before being submerged in molten solder.
The procedure of DIP wave soldering is done automatically. Having said all of that, the process starts with a PCB board. PCB continues to travel ahead beside the conveyor belt.
After this, the machine sprays the board in a separate tank. At this point, a very thin coating of flux will be applied to the underlying surface of the PCB and the pins. After that, the board plate will go down to the zone where it is preheated.
In this region of the flux, the solvent begins to evaporate. Then, the active agent and the resin present in the PCB flux undergo a process of decomposition and activation. During this step, you must give the board and the components complete preheating.
The bottom of the board encounters its first wave of molten solder as the board continues to move ahead. The welding flux is printed on the PCB with the assistance of this wave. The second wave of hot solder then strikes the bottom of the printed circuit board (PCB).
This moderate wave contributes to the division of the connecting bridge that is between the welding end and the pin. In addition to this, it eliminates welding faults.
There is a wide variety of solder machines on the market. Let’s take a look at the machine a little!
Wave Soldering Machine
A soldering machine has the following four components:
- Flux sprayer
- Preheating pad
- The pump creates the wave
- Pan solder
A wave soldering machine has a solder tank that is heated. And a specific temperature is kept on it for the soldering process.
Most of the time, a solder wave is inside the tank. And the PCBs go over the bottom of the board. So, the board links up with the solder wave at that point.
Also, one needs to be careful when changing the wave’s height. By doing this, you would stop the wave from going over the front of the board. This is when the solder gets to where it needs to be.
Also, the metal fingers on the conveyor make sure that the PCB stays in place in a specific spot. Different temperatures won’t hurt the metal fingers. And the reason is that it is made of titanium. Plus, the solder doesn’t change it in any way.
Manual Soldering of Components
Manual soldering is a traditional method of soldering leaded components to a PCB. It is generally used for PCB-Bestückung in Kleinserie, laboratory assembly work, rework/repair, and the addition of extra components on a machine soldered assembly.
Manually soldered components should be placed further away from other components to avoid solder bridging. Typically, 50 to 100 mil pad-to-pad spacing should be maintained.
In the majority of instances, solder is applied as flux-cored wire. When producing soldered connections manually, the operator may see the creation of the junction and adjust the soldering process to different circumstances, such as solderability. With this in mind, manual soldering is still employed to make electrical connections that need the greatest level of dependability. However, when bulk soldering is required, manual soldering of high quality is not economically practical.
Use of Solder Iron
Learning to solder by hand is an acquired talent. An electrical current is used to heat the tip of the soldering iron. A soldering bit is a metal piece with a tinned tip used for soldering. Since heat conduction from the tip to the joints is generally weak, the tip temperature must be greater than the soldering temperature.
A soldering iron with a properly tinned tip is essential for achieving quality connections. Only a damp cloth or sponge, never a file or steel brush, should be used for cleaning. Commercially available soldering iron bits come in a wide range of shapes and sizes, with some being explicitly designed as hollow suction desoldering iron bits. Many have advocated for the tips to be standardized, although this has yet to happen.
The surface of the PCBA will still have flux, ionic impurities, organic residues, and other substances after the soldering process is complete. The majority of circuit leakage may be attributed to the impurities that have attached themselves to the surface of the PCBA board. These compounds have the potential to cause harm to electronic components and disrupt circuits. Ionic contaminants on the board’s surface can cause it to malfunction if it is kept in a humid environment. This will lead to common PCBA failures or even circuit board shorts. Because of this, not only is it necessary for us to clean the PCB before soldering but also the cleaning that occurs after soldering is of utmost significance.
Even though water washing is one of the more affordable options, it is often used only after an in-depth investigation of technical procedures has been conducted. So, water-washing fluxes must be powerful enough to leave behind corrosive residues on the PCB and its components if they are to be used. It’s essential to keep in mind that water won’t remove rosin-based or synthetic, water-insoluble fluxes. Although water cleaning is a cost-effective option, it requires a thorough understanding of the underlying technology before we can use it effectively.
Inspection and Functionality Test
Während der Through hole assembly process, your printed circuit board (PCB) must undergo several checks, these DIP PCB-Baugruppeninspektion include: visual inspections, in-circuit testing (ICT) or flying probe tests, and even automated or semi-automatic bench tests. Printed circuit board (PCB) functional testing determines if we may send a produced board to a customer after it has been made and left the factory. PCB functional testing is the most exhaustive testing regimen available. The objective is to uncover manufacturing faults that impair dependability, such as missing or wrong components, and solder connections that aren’t correctly connected.
So, the DIP PCB board is subjected to incoming inspections that comply with the applicable standard and regulations. Things that need to be checked when inspecting components include whether the components’ performance, specifications, and packaging meet order requirements, product reliability requirements, assembly technology and equipment requirements, and storage requirements. In addition to the basic checks mentioned above, we also test the lead collinearity and lead coating layer thickness to verify that they can withstand heating and comply with the technology’s requirements.
After ensuring there are no issues, the printed circuit board assembly (PCBA) will be put together with the housing, put through further testing, and ultimately sent. The creation of PCBAs is a loop of a ring, and since any fault in one link would substantially influence the quality of the product as a whole, strict control of each step is essential.
As a PCB company, FS Technology has spent a lot of time honing its expertise in DIP assembly. We are a one-stop shop for DIP assembly, electronic component procurement, finished product assembly, and testing.
In addition to implementing overall quality and environmental management, we also use cutting-edge machinery for PCB-Herstellung and testing.
Manual or automatic through-hole assembly?
Automated through-hole Assembly
In THT automated assembly, machines that are controlled by a computer are used to position components on a circuit board. We may accomplish this by using various methods, such as machines to arrange components on the board or by using machines to solder the components into place. Using equipment, FS technology ensures the best quality product assembly at the lowest feasible cost. Scheduled preventative maintenance is used to keep all of FS technology’s machinery in good working order. Here are the advantages of choosing our automated DIP assembly services:
- Fully automatic equipment can easily achieve fast turnaround PCB assembly services, but it is more suitable for high-volume PCB assembly. The assembly method is ideal for swiftly constructing a large number of PCBA or creating anything that is highly complicated and has a lot of DIP components.
- Automated assembly may help you save both time and money while producing products of a high standard. Compared to manual assembly, automated PCB assembly offers a variety of benefits that make it the superior option.
- The primary advantage is that machines may position components considerably more rapidly than a person can. In addition to this, the method is versatile enough to deal with boards of varying dimensions and degrees of complexity.
Manual through-hole Assembly
When it comes to complex DIP Assembly tasks, FS technology is up to the task. We’ve structured our manual lines to cut down on product movement and worker motion as much as possible. The accurate and complete assembly is guaranteed by careful documentation and in- process inspections. We’re a versatile and reasonably priced contract manufacturer because of our DIP Assembly expertise. Manual printed circuit board DIP assembly is performed using a microscope, so it is slower and suitable for small batch PCB assembly orders. Here’s why this through-hole assembly has survived:
- Low-volume orders, especially those involving very tiny or fragile components, sometimes need this assembly.
- There is a high degree of accuracy, and the user may readily adjust the positioning of each part. However, it is time-consuming, costly, and challenging to master.
- Assembling by hand provides greater room for personalization and adaptation. When using automated assembly, you can only work with the components the machine offers.
- Assembling components by hand also encourages greater originality and improvisation. You may be creative in your approach to PCB assembly without being limited by mechanical means. This might result in increased product quality and a more significant advantage in the market.
- Power outages and other environmental factors may have a negative impact on automated assembly, leading to faulty products. Manual assembly is immune to delays like this. You may exert greater influence on the final result.
Which is Better: Manual or Fully automated Assembly?
When deciding between manual and automated PCB assembly, there are many different considerations to consider. The size and complexity of the printed circuit board (PCB), the number of necessary assemblies, and the degree of accuracy required are often essential concerns.
Manual assembly is preferable for less complex and smaller PCBs, as indicated before. On the other hand, it takes more time than automated assembly. Automated assembly is preferable for printed circuit boards that are bigger and more complicated. The price is higher, but the assembly time is reduced compared to human labor.
What is the difference Between SMT and DIP Assembly?
SMT employs a technique called “sticking” whereas DIP utilizes a technology called “plugged-in.” Electronic components that use the DIP standard feature two rows of pins.
In most cases, surface mount technology is put on the top surface of components that do not have pins or short leads:
- The solder paste must be printed on the circuit board.
- The board must be mounted using the mounter.
- The device must be repaired by reflow soldering.
On the other hand, the in-line packaging device known as “dip welding” may have its connections repaired using wave soldering or hand welding.
Only components with no pins or short pins, such as QFN, DFN, and BGA assembly components, can be assembled using the surface-mount technology known as SMT assembly. It must first print solder paste on the printed circuit board (PCB), then use a surface mount technology (SMT) machine to solder the components, and then utilize reflow soldering to secure the components on the PCB.
While DIP is used for soldering the components that come in a through-hole package, components may be fixed on a PCB using either wave soldering or manual soldering.
SMT and DIP are both components of the labor that goes into PCB Assembly; however, not all PCBA businesses have strong SMT and DIP competence, and the quality of the soldering on the PCBs varies from company to company. Suppose you are considering working with a new PCBA manufacturer. In that case, you should see the manufacturer to check how things are together, the equipment used to make things, and other vital parts.
FS technology provides SMT and DIP services of the highest quality.
DIP Advantages over SMT
The benefits of DIP assembly are clear to see. The following is a list of some of the reasons:
Electrolytic capacitors, metal oxide film resistors, and transistors are components that may be damaged by exposure to temperatures too high. Because their temperature resistance ranges from 105-235 degrees Celsius, these components cannot be soldered using reflow soldering.
- Packaging problems
SMT packaging still needs sockets, terminals, and high-power components. This is due to the fact that these components are challenging to manufacture and assemble. Due to this factor, we are restricted to using just the DIP packaging type for such components.
- Cost problem
In spite of the fact that many commonly used components, including integrated circuits, inductors, transformers, diodes, and transistors, currently come in SMT packaging, DIP containers are much less expensive than SMT packages.
- Power Consumption and Size
Several other considerations, including power consumption and size, cause the need to employ DIP rather than SMT components in some designs.
The PCBA electronic processing industry continues to rely heavily on DIP for various reasons, making it a vital component. In contrast to the SMT plug-in, which is automated, the DIP plug-in calls for a large-scale manual process that takes a significant amount of human effort. Due to the extensive labor percentage, DIP’s failure rate is considerable. As a result, keeping an eye on the quality of the PCBA when doing DIP processing is essential. DIP is the follow-up work of SMT, an important part of the PCB assembly process. Große Bauteile, die nicht von der automatischen Maschine eingelegt werden können, müssen jedoch manuell eingesteckt werden und dann durch den Reflow-Ofen zum endgültigen Löten geführt werden.