Keramisches Vierfach-Flachgehäuse-CQFP

CQFP, which stands for Ceramic Quad Flat Pack, utilizes expensive ceramic material, as the name suggests. In the electronics manufacturing industry, components that use ceramic materials such as Keramik-Leiterplatte are costly. CQFP is fabricated using dry pressing, where two rectangular or square ceramic pieces (lid and base) are dry pressed, screen printed with solder glass, and then glazed. The glass is then heated to embed the leadframe into the softened glass of the base, creating a mechanical connection. Once the semiconductor device is mounted and the wires are bonded, a cover is placed on top of the assembly, heated to the melting point of glass, and allowed to cool.

Ceramic Quad Flat Pack

CQFPs have leads on all four sides, typically coated with gold or Kovar, which makes it easy to mount to a printed circuit board (PCB). Lead spacing can vary from 0.5mm to 1.27mm, and quantities are usually between 28 and 352, which is beneficial for applications that require a reliable and long-lasting IC package. Furthermore, compared to plastic packages, ceramic packages can withstand various high-temperature environments and can operate continuously in environments up to 1000 °C while providing exceptional electrical performance. Here is the table for CQFP packaging with some specifications:

Part NumberPin CountBody Size (inches)Body Size (mm)Lead Pitch (mm)
52CQFP-19.0 mm-1.27 mm52.750” square19.0 square mm1.27 mm
68CQFP-24.1 mm-1.27 mm68.950” square24.1 square mm1.27 mm
84CQFP-16.5 mm-.65 mm84.650” square16.5 square mm.65 mm
100CQFP-19.0 mm-.65 mm100.750” square19.0 square mm.65 mm
132CQFP-24.1 mm-.65 mm132.950” square24.1 square mm.65 mm
144CQFP-26.6 mm-.65 mm1441.050″ square26.6 square mm.65 mm
172CQFP-29.2mm-.65mm1721.150″ square29.2 square mm.65 mm
196CQFP-32.0mm-.50mm1961.260″ square32.0 square mm.50 mm

Although this packaging form has many advantages, FS Technologie recommends that you consider the profitability of your product when choosing because it is more expensive and is not suitable for consumer electronics.

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