In scenarios demanding resistance to corrosive environments or high-frequency demands, the implementation of ceramic-based QFN technology can emerge as a strategic choice. By employing ceramic materials as the substrate for the QFN package, a distinct package family is born.
This particular ceramic QFN proves highly suitable for instances where the standard QFN form factor is desired, yet the quest for elevated performance and reliability steers the requirement toward a hermetically sealed air cavity configuration. A diverse array of standard form factors is at one’s disposal, spanning from 3×3 mm to 8×8 mm, each offering a selection of pad counts to cater to different configurations.
Ceramic QFN encompasses a plethora of lid alternatives, encompassing the traditional combination lids plated with gold, as well as cryogenically sealed glass-ceramic lids. The range extends to encompass various base options, embracing bases characterized by high thermal conductivity, tailor-made for power semiconductor applications, and ceramic bottoms designed to ensure the chip’s electrical isolation.
Now, let’s delve into the advantages that ceramic materials bring to the table when juxtaposed with the conventional QFN approach. FS Technology has meticulously curated the ensuing insights for your consideration:
|Feature||Plastic QFN||Ceramic QFN|
|Material||Made with plastic or epoxy resin;||Made of ceramic material;|
|Thermal Performance||Good thermal performance but slightly inferior compared to ceramic materials;||Excellent thermal conductivity, which can dissipate the heat generated when the chip is running faster;|
|Cost||Simple processing and low-cost materials help reduce project costs;||Relatively more expensive due to ceramic material.|
|Electrical Performance||Suitable for standard applications.||Excellent for high-frequency applications.|
|Applications||Consumer electronics, general-purpose.||Due to the high cost, it is more beneficial to apply to high-margin or applications that require high-frequency performance;|
|Weight||Lightweight due to plastic material.||Heavier due to denser ceramic material.|
|Substrate Material||Typically uses FR-4 or similar materials.||Specialized ceramic substrates PCB.|
|Frequency Response||Can be used for high frequency applications but may have limitations in design;||Good frequency response at higher frequencies.|
|Lead Count||Available in various lead counts.||Often available with high lead counts.|
|Hermetic Seal||Not hermetically sealed.||Can be hermetically sealed for increased protection from moisture and contaminants;|
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