BQFP - Bumpered Quad Flat Package
BQFP, short for “Bumpered Quad Flat Package”, is a type of QFP packaging structure with a pin center distance of 0.635 mm and a pin count ranging from 84 to 196. It is commonly used in processing circuits, such as microprocessors and ASICs. The application of SMT PCBA is necessary during the assembly process of BQFP to efficiently combine components with printed circuit boards and use PCB space more effectively.
One of the distinctive features of the BQFP package is the four protrusions on its body corners, which act as a buffer to prevent the bending or deformation of pins due to strong vibrations. The tighter arrangement of pins on the BQFP structure can make the chip smaller while minimizing the circuit design, making it ideal for high-speed data transmission and high-power applications.
BQFP is widely used in various electronic devices, from consumer electronics to military equipment, and can be found in digital signal processors, network communication equipment, and other electronic devices. As a professional PCB assembly service provider, FS-PCBA.COM offers not only specialized PCB knowledge but also comprehensive PCBA services, including manufacturing, assembly, testing, and delivery. If you have any needs, please feel free to contact us by email.
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