BGA vs. QFN
In the field of electronics, selecting the correct package form for integrated circuits is one of the key tasks for engineers. This includes the oldest form of DIP packaging, the compact and highly integrated CSP packaging, and the solder ball grid array-based LGA packaging, among others. Undoubtedly, these packages have unique characteristics and application domains. To facilitate a smoother progress in your electronic engineering endeavors, this article by FS Technology offers an essential packaging guide to differentiate between two commonly used packages: QFN and BGA.
|Definition||QFN stands for Quad Flat No-Lead, which is a type of surface mount package.||BGA stands for Ball Grid Array, which is connected to the PCB through an array of solder balls on its bottom side.|
|Package Shape||Square or rectangular||Round|
|Applications||Commonly used in consumer electronics PCB, common ones include smartphones, tablets, smartwatches, etc.||The first choice for high-performance applications, including GPU, CPU, PLC, etc.|
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