Precision BGA Assembly Services – Your Offshore PCB Assembly Partner
One-stop SMT & DIP production line with in-house BGA rework and reballing. Certified to IPC-A-610 Class 2/3.
Get a Quote →What is BGA Assembly?
Ball Grid Array (BGA) is a surface-mount package where solder balls are arranged in a grid on the underside of the component. Unlike QFP or SOP, BGA hides its interconnections under the body, allowing much higher I/O density, shorter signal paths, and better thermal/electrical performance.
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Key Advantages of BGA Assembly
High I/O density
3–5× more connections than QFP in the same footprint.
Electrical performance
Low inductance/capacitance, ideal for DDR4/5, PCIe, 10G+ signals.
Self‑centering
During reflow, surface tension pulls the chip into perfect alignment.
Thermal dissipation
Solder balls act as thermal vias; many BGAs have an exposed die pad for heatsinking.
Mechanical reliability
Uniform ball grid withstands vibration and thermal cycling better than fine‑pitch leads.
BGA Assembly Capabilities
Explore our detailed capabilities, state-of-the-art equipment, and rigorous quality control standards for professional BGA assembly services.
| BGA types | PBGA, CBGA, FBGA, µBGA, LGA, PoP |
|---|---|
| Minimum ball diameter | 0.25mm (10mil) |
| Minimum ball pitch | 0.35mm (14mil) |
| Max BGA size | 65×65mm (larger on request) |
| Max PCB size | 500×500mm |
| Placement accuracy | ±35µm @ 3σ |
| Reflow zones | 10 zones, N₂ protection optional |
| Void control | <15% typical, <10% upon request |
| Solder alloys | SAC305 (lead-free) |
| Pick & Place | Panasonic's 2+1 high-speed combination supports networked data acquisition and integration with production line SPC and MES systems. |
|---|---|
| Reflow Oven | 10-zone with N₂, ±1°C uniformity |
| Inspection | 2D X-Ray (minimum resolution 5µm), 3D CT optional, AOI, SPI |
| BGA Rework | Hot air, temperature-controlled soldering iron, heating table |
| Others | Stencil printer, solder paste thickness tester, KIC thermal profiler |
| Reflow profiling | Oven temperature is measured daily/after each line change, and is also measured individually for each board type. |
|---|---|
| MSL control | Adhering to IPC-J-STD-020 standards; products with an MSL ≥ 3 require baking before use. |
| X-Ray strategy | High-reliability products (medical/automotive industries) are 100% inspected; other products undergo sampling inspection. |
| Traceability | Each board is affixed with a laser barcode, and each process step has a unique code. |
Our BGA Assembly Products Showcase
Common BGA Defects & Prevention
| Defect | X-Ray Signature | Root Cause | Our Countermeasure |
|---|---|---|---|
| Head-in-Pillow (HIP) | Blurred edge, dumbbell shape | Board warpage, insufficient TAL | Fixture flattening, extend TAL, profile under BGA |
| Voids | Dark spots inside joint | Outgassing, flux residue | Optimised stencil apertures, proper soaking time |
| Bridge | Connected balls | Excess solder, high placement pressure | SPI control, reduce stencil thickness |
| Cold solder | Rough, dull surface | Insufficient peak temperature | Verify profile, tighten oven uniformity |
| Non-wetting | No solder spread on pad | Pad oxidation, poor flux activity | Bake PCBs, use RMA/ROL0 flux |
One-Stop SMT + DIP Process Flow
Bake PCB
Solder paste printing (custom stencil for BGA)
High‑speed placement
N₂ reflow
X‑Ray inspection
AOI / ICT (optional)
BGA rework if needed
Cleaning & packaging
Additional note: DIP production lines can protect soldered or heat-sensitive components such as BGAs by selective wave soldering or wave soldering fixtures, avoiding the risk of secondary heating.
Why Choose FS Tech for BGA Assembly Services?
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English documentation
Review Gerber/BOM, output English reports.
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Fast logistics
DHL/FedEx/UPS account or our coop carrier – customs clearance support.
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Rapid prototyping
3–5 days for BGA prototypes (express available).
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One‑stop service
After BGA, we do DIP, wave soldering, conformal coating – no extra vendor.
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24h response
English / Chinese via email.
FAQ about BGA Assembly Service
BGA assembly involves soldering a BGA package (with an array of solder balls on its underside) onto a printed circuit board (PCB). It’s used for high-density, high-performance components (e.g., processors, FPGAs) because it offers:
Shorter electrical paths
Better heat dissipation
Higher I/O count in a small footprint
Pick-and-place machine with vision alignment
Reflow oven (convection or vapor phase) with precise temperature profiling
X-ray inspection system (to check hidden solder joints)
Stencil printer for solder paste application
Pre-heater and rework station
≥ 0.8 mm – standard, reliable
0.5 mm – requires precise stencil and placement
0.4 mm – challenging; needs ultra-fine stencil, controlled reflow, and often underfill
≤ 0.35 mm – advanced process (may use flux dip instead of paste)
Generally it is used for Mechanical strength applications (namely electrical connectors transformers large capacitors) or for prototypes/Vintage applications where SMT cannot be used. THT tends to be more reliable in bled environments/higher temperture.
DIP, also known as Dual In-line Package or DIL Package, refers to a specific type of electronic component packaging that features two parallel rows of pins or leads extending from the bottom of the package. DIP package is widely used in electronic assemblies due to their compact size and ease of insertion into PCBs.
THT, on the other hand, stands for Through-Hole Technology. It refers to the manufacturing process that involves drilling holes on a PCB and inserting component leads or pins through these holes. The components are then soldered on the opposite side of the PCB to establish electrical connections.
While DIP is commonly associated with the type of component package used in PCB assembly, THT is the manufacturing process that involves the insertion and soldering of components through holes.
Cost drivers include:
BGA pitch & size (finer pitch = higher cost)
PCB surface finish (ENIG preferred over HASL)
X-ray inspection (per board or spot check)
Rework (hourly rate + risk of board damage)
Underfill (optional, for mechanical reliability)
Get an Instant Quote
Upload your Gerber/BOM files to get a direct online quote from our team.
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