Aluminum Nitride PCB

Aluminum nitride (ALN) is a specialized ceramic PCB substrate material renowned for its exceptional thermal conductivity, chemical resistance, and dielectric strength. Its remarkable thermal conductivity, ranging from 120 to 200 W/m·K, makes it particularly well-suited for demanding electronic applications characterized by high power dissipation, high frequency operation, or exposure to harsh environmental conditions.

At FS Technology, we possess the expertise and capabilities to supply you with 1-2 layer aluminum nitride PCB, along with comprehensive electronic assembly services, streamlining your procurement process. In the following sections, we will provide you with an in-depth introduction to this cutting-edge PCB technology, enabling you to gain a comprehensive understanding of its features and benefits.

Material Properties of Aluminum Nitride Ceramic PCB

  • Thermal Conductivity: Aluminum nitride ceramic boards exhibit high thermal conductivity, typically ranging from 120 to 200 W/m·K. This exceptional feature enables efficient heat dissipation, making them optimal for applications requiring effective thermal management, such as power electronics and RF/microwave devices.
  • Electrical Insulation: These circuit boards possess excellent electrical insulation properties. With a high breakdown voltage and low electrical loss, they provide reliable isolation and minimize electromagnetic interference (EMI). This characteristic is crucial for applications where complete electrical component isolation is necessary.
  • Dielectric Constant: Aluminum nitride ceramic boards also demonstrate a high dielectric constant, ranging from 8 to 10. This attribute is particularly advantageous for high-frequency applications, enhancing signal propagation and reducing signal losses.
  • Thermal Expansion: The coefficient of thermal expansion (CTE) of aluminum nitride is similar to that of silicon, facilitating compatibility with silicon-based components. This minimizes thermal stress and the risk of failure in electronic assemblies utilizing both substrate material and silicon devices.
  • Mechanical Strength: These boards possess robust mechanical strength, enabling them to withstand mechanical stress and provide structural stability. This resilience makes them well-suited for automotive electronics, aerospace systems, and industrial PCBA that require durability and reliability.
  • Chemical Stability: Aluminum nitride is chemically inert and resistant to corrosive conditions, ensuring the stability and longevity of AlN ceramic PCB. This property proves invaluable in harsh operating environments where the boards may be exposed to moisture, chemicals, or other corrosive agents.
  • Machinability: Can be machined to achieve intricate shapes and features on the board. This capability facilitates the fabrication of customized PCB designs with complex geometries and heat sink structures, catering to specific application requirements.
  • Density: These substrate materials possess a low density, typically around 3.26 g/cm³. This lightweight characteristic allows for the design of boards with reduced weight, which is advantageous in applications where lightweight components are crucial, such as portable electronics or aerospace systems.
  • UV Radiation Resistance: Aluminum nitride ceramic circuits exhibit excellent resistance to ultraviolet (UV) radiation, enabling them to withstand prolonged exposure to UV light without degradation or damage. This property proves valuable in outdoor electronics or UV sterilization equipment.
  • Temperature Resistance: These boards demonstrate exceptional thermal stability and can withstand high temperatures. With a high melting point of approximately 2200°C, they maintain their structural integrity and electrical performance even in elevated temperature environments.

How to Construct an Aluminum Nitride PCB

Aluminum nitride, being a high-purity substrate material, requires specialized techniques to ensure its successful fabrication. At FS Technology, we currently offer manufacturing capabilities for 1-2 layer ceramic PCB. For multi-layer PCB fabrication, we recommend considering our Rogers Ceramic PCB, which is better suited for such requirements.

When it comes to constructing aluminum nitride PCBs, we employ two primary fabrication techniques: direct nitridation and carbothermal nitridation and reduction. Let’s explore each of these techniques in detail to provide you with a comprehensive understanding.

Direct Nitridation

Process Flow

Direct nitridation is the predominant technique used for the manufacturing of aluminum nitride PCB. This process involves subjecting aluminum to high temperatures in a controlled atmosphere, resulting in the formation of an aluminum nitride substrate.

  1. Aluminum Source: The process commences with the utilization of an aluminum source, which can be in the form of powder, pellets, or a structured substrate.
  2. Nitrogen Environment: Next, the aluminum material is exposed to a nitrogen-rich environment. This is achieved by introducing nitrogen gas (or ammonia, NH3) into the reaction chamber.
  3. Heating and Reaction: Subsequently, the aluminum and nitrogen undergo a high-temperature reaction, typically conducted within the range of 1000 to 2000 degrees Celsius (or 1832 to 3632 degrees Fahrenheit). This exothermic reaction generates heat, which facilitates the conversion of aluminum into aluminum nitride.
  4. Controlled Atmosphere: To prevent oxidation or contamination, the entire process is meticulously carried out under controlled conditions. The reaction chamber is purged with nitrogen or ammonia to establish a nitrogen-rich environment, thus minimizing the formation of undesired byproducts.
  5. Cooling and Solidification: Once the reaction is complete, the temperature is gradually reduced, allowing the aluminum nitride to cool and solidify. The resulting solid material undergoes further processing and is shaped into an aluminum nitride PCB.


  • Purity: Direct nitridation enables the production of highly pure aluminum nitride. The direct reaction between aluminum and nitrogen gas yields a product with minimal impurities, ensuring a high level of purity.
  • Control: This technique offers precise control over the creation of aluminum nitride, allowing for meticulous adjustment of process parameters to achieve the desired features and characteristics.
  • Efficiency: It is a streamlined and efficient PCB manufacturing process, requiring fewer steps and resources compared to carbothermal nitridation and reduction.
  • High Quality: The direct nitridation process consistently produces aluminum nitride with excellent thermal conductivity and electrical insulation properties. These qualities make it highly suitable for demanding high-performance applications.
  • High-Temperature: This process is a temperature-sensitive process, typically performed within the range of 1000-2000 degrees Celsius (or 1832-3632 degrees Fahrenheit), ensuring optimal results and material properties.

Carbothermal Nitridation and Reduction

Process Flow

As an alternative to the direct nitridation process, a method involving the use of mixtures comprising alumina and carbon-based materials such as carbon black or graphite is employed.

  1. Mixture Preparation: Aluminum oxides and carbon-based materials, such as carbon black or graphite, are meticulously blended in the specified ratio. The carbon component acts as a reducing agent, facilitating the removal of oxygen from the aluminum oxide.
  2. Heating and Nitridation: The prepared mixture is subjected to high temperatures within a nitrogen-rich atmosphere. Under these conditions, the carbon and oxygen within the aluminum oxide react, resulting in the formation of aluminum nitride. Nitrogen gas is utilized during the nitridation process.
  3. Cooling and Solidification: Upon completion of the reaction, the material is gradually cooled to allow for the solidification of the formed aluminum nitride or other nitride ceramics. The solidified material is then further processed into an aluminum nitride ceramic PCB board.


  • Versatility: Carbothermal nitridation and reduction offer the capability to produce various nitride ceramics, including Aluminum Nitride and Alumina Nitride. This technique provides versatility in manufacturing different types of nitride materials.
  • Cost-effectiveness: Utilize readily available and cost-effective materials such as aluminum oxide and carbon-based substances. These materials are more economical compared to other precursor materials.
  • Impurities: It is important to note this process may introduce impurities into the final product due to the utilization of carbon-based materials as reducing agents. These impurities can potentially affect the thermal conductivity and electrical properties of the material.
  • Control Challenges: Achieving precise control over reaction conditions, such as temperature, composition, and gas environment, can be more challenging in carbothermal nitridation and reduction compared to direct nitridation. This can result in variations in the characteristics of the final product.
  • Additional Processing Steps: Manufacturers may need to incorporate additional processing steps during production, such as purification or refining, to remove impurities and achieve desired material properties.
  • Carbon Contamination: The presence of carbon in carbothermal nitridation can lead to carbon contamination within the Aluminum Nitride material. This contamination can impact the electrical properties and potentially compromise the performance of the PCB board.

Aln PCB VS Other Ceramic Substrates

Ceramic MaterialThermal Conductivity (W/m·K)Dielectric ConstantDielectric Strength (kV/mm)Coefficient of Thermal Expansion (ppm/°C)Cost
ALN PCB120-2008-1015-204.5-5.5High
Al2O3 PCB20-359-1015-256-8Medium
Beryllium Oxide200-2306-712-157-9High
Silicon Carbide200-4009-1015-204-5High
Boron Nitride25-1504-625-302-6High
Aluminum Silicate1-34-54-84-7Low

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