Alumina Substrate PCB
As an essential component of electronic products, printed circuit boards play a crucial role, necessitating the adjustment of substrate materials to cater to specific application requirements. However, this presents a challenging task for designers. They are confronted with a diverse range of materials, including metals (such as aluminum, copper, and iron), FR4 (comprising fiberglass cloth and epoxy resin), and ceramics (like aluminum oxide, aluminum nitride, and aluminum carbide). Each material possesses unique advantages, characteristics, and attributes, underscoring the need for designers to acquire a comprehensive understanding to make informed choices.
Fortunately, by partnering with FS Technology, the premier Chinese manufacturer, clients not only gain access to our exceptional manufacturing and assembly services but also benefit from our design consultation and professional expertise. At FS Technology, we take pride in providing detailed insights to our customers. Today, we would like to introduce one such material suitable for ceramic PCB: alumina substrate.
Best Alumina PCB Manufacturer
FS Technology, a renowned alumina PCB manufacturer in China, specializes in providing comprehensive PCBA services encompassing manufacturing and assembly for customers across diverse industries. We take pride in offering a wide range of alumina substrate PCB with varying specifications. Kindly refer to the following table for detailed information regarding our offerings:
| Characteristics | 96% Alumina | 99% Alumina |
|---|---|---|
| Appearance | White | Beige |
| Density | 3.6g/cm³ | 3.9g/cm³ |
| Hardness | 1500HV | 1700HV |
| Warpage | ≤0.3mm | ≤0.2mm |
| Parallelism | ±0.4% | ±0.3% |
| Bending Resistance | 3000Kgf/cm² | 3500Kgf/cm² |
| Compressive Strength | 25000Kgf/cm² | 30000Kgf/cm² |
| Fracture Toughness | 3-4Mpa m1/2 | 4Mpa m1/2 |
| Thermal Conductivity | 25W/(m·K) | 31.4W/(m·K) |
| Voltage Resistance | 18KV | 18KV |
| Dielectric Constant [1MHz, 25°C] | 9.4 | 10 |
| Surface Roughness Ra | 0.6-0.8μm | 0.6-0.8μm |
| Water Absorption | 0% | 0% |
| Sintering Temperature | 1689°C | 1700°C |
| Volume Resistivity | / | / |
| Thermal Shock Resistance | 200T°C | 220T°C |
| Thermal Expansion Coefficient [20°C to 300°C] | 6-7.5×10ˆ(-6)°C | 8-10×10ˆ(-6)°C |
| Maximum Use Temperature | 1400°C | 1600°C |
High Quality Manufacturing Process
- Raw material selection: The quality of the substrate is significantly influenced by the purity and particle size distribution of the powder. Therefore, the initial step towards ensuring high-quality production is to carefully choose premium-grade alumina powder. If you already have a preferred material supplier, you can either procure the powder yourself or rely on FS Technology for assistance in the procurement process.
- Powder preparation: Once the raw materials are acquired, several essential processing procedures are undertaken to control the particle size, shape, and purity of the powder. These procedures involve grinding, mixing, filtering, washing, and other necessary steps.
- Molding: After the powder is processed, it undergoes a molding stage to shape it into the desired substrates. This is typically accomplished through various technologies such as injection molding, extrusion molding, compression molding, among others.
- Sintering: The molded substrate lacks the desired reliability, so it undergoes a high-temperature sintering process. This process allows the particles to fuse together, resulting in dense substrates with optimal density and crystal structure.
- Conventional process: It is basically similar to the PCB manufacturing process. Once the circuit is fabricated, it can proceed to the assembly stage. However, it is important to note that FS Technology’s current manufacturing capacity enables the production of Al2O3 PCB with a maximum of 1–2 layers. Due to the fragility of these boards, manufacturers must exercise meticulous attention to manufacturing details during the production process.
Why Use Alumina Substrate PCB
Currently, among the various materials used for ceramic substrates, alumina and Rogers are the most commonly utilized options in the industry. When comparing them, aluminum oxide or Al2O3 PCB stands out as a purer ceramic board with superior properties, albeit being more challenging to process due to its fragility. However, its excellent electrical and thermal properties have made it widely preferred.
In large-scale LED lighting projects, aluminum oxide substrates play a crucial role in extending the lifespan of electronic applications by facilitating exceptional heat transfer capabilities. As the system operates, the components integrated onto the PCB generate substantial amounts of heat due to high current flow, and this heat continues to accumulate. If the temperature surpasses a critical threshold, component overload or circuit board burnout issues can arise. The thermal conductivity of an alumina substrate PCB typically ranges between 20-30 W/m·K, enabling efficient thermal management and heat dissipation within the system.
Now, one may question why we don’t exclusively use Aluminum PCB.
Undoubtedly, aluminum PCBs are also commonly employed in LED projects, and their usage frequency exceeds that of alumina PCBs. Pure aluminum, under equivalent conditions, is easier to process and comes at a lower cost. Additionally, its thermal conductivity is approximately ten times higher than that of alumina, reaching around 205 W/m·K.
However, when selecting between the two options, it is vital to consider not only thermal conductivity but also factors such as surface reactivity and thermal expansion coefficient, which are crucial concerns for designers. Under high-temperature conditions, pure aluminum readily reacts with oxygen in the air, forming an aluminum oxide layer. Furthermore, its high thermal expansion coefficient may cause thermal stress and reliability issues as it does not match that of other materials.
On the other hand, alumina circuit boards excel in these aspects. In addition to providing excellent thermal management, they offer superior electrical insulation and mechanical strength. They can withstand high voltages without experiencing electrical breakdown, thereby enhancing the overall robustness of the electronic system.
Moreover, alumina ceramic PCB inherits the advantageous dielectric constant characteristic of ceramic PCBs, which improves charge polarization ability and energy storage capacity in an electric field. Typically, the dielectric constant ranges between 8-10. This exceptional quality makes alumina ceramic PCB ideal for power, automotive, defense, and other high-frequency applications where signal integrity is a critical requirement.
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