Production Lines & Advanced Equipments
Workshop and Office
PCB Assembly Advanced Equipments
Solder paste printing machine and solder paste dispensing machine are easily confused concepts. The picture above shows a solder paste printing machine, which uses a printing scraper or printing roller to evenly press the solder paste on the surface of the circuit board with the pad position. The solder paste dispenser uses a dispensing needle or nozzle to control the flow and position of the solder paste to apply the solder paste to a specific area of the circuit board in a dispensing manner.
Connect different equipment of SMT production line for staged circuit board delivery.
The core equipment of the SMT assembly is used to accurately mount components on the surface of the PCB board. FS Technology is equipped with 7 SMT production lines to achieve fast turnaround PCBA, the following is the equipment of other production lines.
Plug-in technology is usually used for DIP components, and some small workshops are completed in the form of manual plug-ins. FS Technology’s PCBA facility is equipped with advanced AI plug-in machines to help realize automated through-hole assembly projects.
Soldering Equipment
Located in the SMT production line, as shown, the reflow soldering machine used by FS Technology contains ten temperature zones, which can better complete the soldering of SMD components
Used as a post-assembly soldering process, wave soldering is typically found in through-hole assembly lines.
Testing Equipment
A device for detecting and analyzing the internal structure of an object, which penetrates the object through an X-ray beam and generates an image. In the PCBA field, X-Ray inspection can provide advantages such as defect detection, internal structure analysis and non-destructive testing.
As shown in the figure above, the AOI equipment is directly connected to the welding equipment, and experienced operators perform automatic optical inspection to help achieve efficient and accurate PCBA.
Also known as SPI detector, it is used to detect the printing quality of solder paste in SMT process. It scans the solder paste printing area through optical or laser technology to detect problems such as offset, short films, defects, missing or excess solder paste.
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