PCB & PCBA Manufacturer
You are here: Home / Manufacturing / Manufacturing Capability

Capability & Info

PCB Manufacturing Capability

Items Rigid PCB Flex PCB   Rigid-Flex PCB     Aluminum/Copper PCB   
Layer Counts 1-20L 1-6L 2-10L (36/10) 1-2L
Maximum Size 1100×650 mm 610×1650 mm 610×1650 mm 1190×600 mm  
Material CME1、CME3、FR-4, High TG FR4 , Halogen-free FR4 , Polyimide ,aluminium 、Ceramic(96% Alumina)    Teflon、PTFE(F4B,F4BK), Rogers(4003,4350,5880) Taconic(TLX-8,TLX-9), Arlon(35N,85N) etc.
Material Mixed Laminate 4 layers to 10 layers (FR4+Ro4350, FR4+Aluminium, FR4+ FPC)
Board Thickness 0.1mm to 10.00 mm
Copper Thickness   0.5-6OZ, Pilot Run: 12 OZ
Minimum Line / Space   0.075 mm (3 mil)
Board Outline Tolerance ± 0.1 mm
Trace Width Tolerance   10%
Minimum Drilling Hole Mechanical 0.1 mm, Laser Hole 0.075 mm
Hole Position/Hole Tolerance  ±0.05mm     PTH: ± 0.076MM    NPTH: ± 0.05mm
Mini Solder Mask Bridge 0.05 mm
 Impedance Control Tolerance  ± 8%
Surface Finishing HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver,Plated gold , OSP, Carbon ink, ENEPIG, Gold Finger
Special Process Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.
Lead-time (1-2 layers) Usually 2-5 days. High Volume 5-7 days
Lead-time (4-8 layers) Usually 2-5 days. High Volume 10-25 days
Lead-time (10-20 layers) 10-20 days, depends on the actual design
Acceptable File Format ALL Gerber Files、POWERPCB、PROTEL、PADS2000、CAD、AUTOCAD、ORCAD、P-CAD、CAM-350、CAM2000 etc.

PCB Assembly Capability

SMT Lines 7 Lines   
Capacity 8 Million Placements Per Day
Max Board Size 680×500 mm  Smallest: 0.25" x 0.25"
Min Component size     0201 – 54 sq. mm. (0.084 sq. inch), Long Connector, CSP, BGA, QFP
Speed 0.15 sec/chip, 0.7 sec/QFP
Wave-Solder Max. PCB Width: 450 mm
Min. PCB Width: unlimited
Component Height: Top 120mm/Bot 15mm
Sweat-Solder  Metal Type: Part, Whole, Inlay, Side-step
 Metal Material: Copper, Aluminum
 Surface Finish: Plating Au, Plating Silver, Plating Sn
 Air Bladder Rate: less than 20%
 Press-fit  Press Range: 0-50 KN
 Max. PCB Size: 800X600 mm
Quantity No MOQ. (Prototype & Low/High Volume PCB Assembly)
Assembly Types SMT and Thru-hole
Solder Type Water Soluble Solder Paste, Leaded and Lead-Free
Components Passives Down to 0201 Size BGA and VFBGA Leadless Chip Carrier/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mil BGA Repair and Reball Part Removal and Replacement-Same Day Service
File Formats Bill of Materials, Gerber Files, Pick-N-Place File (XYRS)
Type of Service Turn-Key, Partial Turn-Key or Consignment
Component Packaging Cut Tape, Tube Reels Loose, Parts
Turn Time 1-15 days  
Testing XRAY Inspection, AOI Testing, ICT, Flying Probe, Burn-in, Function Test.

About Us

Quick Links

Contact Info

 Tel: +86 755 8696 6026 
 E-mail: info@fs-pcba.com
 Phone: +86 137 1530 7049
 Add: Room 301-302, HuaSui Building, Xicheng Industrial Park Building 47, Xixiang Road, Bao'an, Shenzhen, China

Copyright © FS Technology Co., Ltd. All rights reserved.